Semiconductor package

There is provided a semiconductor package including: a package substrate; an interposer mounted on the package substrate; a first semiconductor chip mounted on the interposer; a plurality of second semiconductor chips mounted on the interposer to surround at least a portion of the first semiconducto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHO YUN-RAE, KIM HYUN-GEUN, BAEK SEUNG-DUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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