Semiconductor package

There is provided a semiconductor package including: a package substrate; an interposer mounted on the package substrate; a first semiconductor chip mounted on the interposer; a plurality of second semiconductor chips mounted on the interposer to surround at least a portion of the first semiconductor chips; a heat radiation member disposed on the first semiconductor chip and the plurality of second semiconductor chips; and a heat blocking member extending from a portion of the heat radiating member and disposed in at least one of a first space between the first semiconductor chip and at least one of the plurality of second semiconductor chips and a second space between at least two of the plurality of second semiconductor chips. 提供了一种半导体封装，其包括：封装基板；中介层，安装在封装基板上；第一半导体芯片，安装在中介层上；多个第二半导体芯片，安装在中介层上以围绕第一半导体芯片的至少一部分；热辐射构件，布置在第一半导体芯片和所述多个第二半导体芯片上；以及热阻挡构件，从热辐射构件的一部分延伸并布置在第一半导体芯片和所述多个第二半导体芯片中的至少一个之间的第一空间以及所述多个第二半导体芯片中的至少两个之间的第二空间当中的至少一个空间中。