Chip structure and method for forming chip structure

The invention provides a chip structure and a method for forming the same. The chip structure comprises a substrate. The chip structure includes a first wire over the substrate. The chip structure includes an insulating layer over the substrate and the first wires. The chip structure includes a cond...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAN KAIJUN, LIN YONGSHENG, XUE CHANGRONG, HUANG HUIMIN, LIN WEIHONG, ZHENG MINGDA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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