Chip structure and method for forming chip structure

The invention provides a chip structure and a method for forming the same. The chip structure comprises a substrate. The chip structure includes a first wire over the substrate. The chip structure includes an insulating layer over the substrate and the first wires. The chip structure includes a conductive pillar over the insulating layer. The conductive column is integrally formed and is provided with a lower surface, a protruding connecting part and a protruding locking part, the protruding connecting part protrudes out of the lower surface, penetrates through the insulating layer and is in direct contact with the first wire, and the protruding locking part protrudes out of the lower surface and is embedded in the insulating layer. The chip structure includes a solder bump on the conductive pillar. The solder bump directly contacts the conductive pillar. 本公开提供一种芯片结构及形成芯片结构的方法。芯片结构包括基板。芯片结构包括第一导线，位于基板上方。前述芯片结构包括绝缘层，位于基板和第一导线上方。前述芯片结构包括导电柱，位于绝缘层上方。导电柱为一体成型，导电柱具有下表面、突出连接部和突出锁固部，突出连接部突出于下表面，并且穿过绝缘层且直接接触第一导线，突出锁固