CMOS image sensor and preparation method thereof

The invention provides a CMOS image sensor and a preparation method thereof, and the method comprises the steps: providing a substrate, forming a photodiode region and a floating diffusion region in the substrate, and forming a first well region in the photodiode region; respectively forming a secon...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANG HUIQIN, GUO ZHENQIANG, HE YACHUAN, HUANG PENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JIANG HUIQIN
GUO ZHENQIANG
HE YACHUAN
HUANG PENG
description The invention provides a CMOS image sensor and a preparation method thereof, and the method comprises the steps: providing a substrate, forming a photodiode region and a floating diffusion region in the substrate, and forming a first well region in the photodiode region; respectively forming a second well region and a third well region in the photodiode region; forming a gate oxide layer and a gate electrode; forming a pinning layer on the surface of the third well region; carrying out nitrogen element doping on the surface of the substrate in the photodiode region; and executing a thermal annealing process. Nitrogen element doping is performed on the surface of the substrate, the thermal annealing process is performed to activate doped ions in the semiconductor structure, and the nitrogen element is promoted to fully react with the silicon element in the substrate to form a silicon-nitrogen bond with higher bonding energy. In the subsequent plasma process, the silicon-nitrogen bond is not easy to break under
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115528055A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115528055A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115528055A3</originalsourceid><addsrcrecordid>eNrjZDBw9vUPVsjMTUxPVShOzSvOL1JIzEtRKChKLUgsSizJzM9TyE0tychPUSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqamRhYGpqaOxsSoAQAo5Srs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CMOS image sensor and preparation method thereof</title><source>esp@cenet</source><creator>JIANG HUIQIN ; GUO ZHENQIANG ; HE YACHUAN ; HUANG PENG</creator><creatorcontrib>JIANG HUIQIN ; GUO ZHENQIANG ; HE YACHUAN ; HUANG PENG</creatorcontrib><description>The invention provides a CMOS image sensor and a preparation method thereof, and the method comprises the steps: providing a substrate, forming a photodiode region and a floating diffusion region in the substrate, and forming a first well region in the photodiode region; respectively forming a second well region and a third well region in the photodiode region; forming a gate oxide layer and a gate electrode; forming a pinning layer on the surface of the third well region; carrying out nitrogen element doping on the surface of the substrate in the photodiode region; and executing a thermal annealing process. Nitrogen element doping is performed on the surface of the substrate, the thermal annealing process is performed to activate doped ions in the semiconductor structure, and the nitrogen element is promoted to fully react with the silicon element in the substrate to form a silicon-nitrogen bond with higher bonding energy. In the subsequent plasma process, the silicon-nitrogen bond is not easy to break under</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221227&amp;DB=EPODOC&amp;CC=CN&amp;NR=115528055A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221227&amp;DB=EPODOC&amp;CC=CN&amp;NR=115528055A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG HUIQIN</creatorcontrib><creatorcontrib>GUO ZHENQIANG</creatorcontrib><creatorcontrib>HE YACHUAN</creatorcontrib><creatorcontrib>HUANG PENG</creatorcontrib><title>CMOS image sensor and preparation method thereof</title><description>The invention provides a CMOS image sensor and a preparation method thereof, and the method comprises the steps: providing a substrate, forming a photodiode region and a floating diffusion region in the substrate, and forming a first well region in the photodiode region; respectively forming a second well region and a third well region in the photodiode region; forming a gate oxide layer and a gate electrode; forming a pinning layer on the surface of the third well region; carrying out nitrogen element doping on the surface of the substrate in the photodiode region; and executing a thermal annealing process. Nitrogen element doping is performed on the surface of the substrate, the thermal annealing process is performed to activate doped ions in the semiconductor structure, and the nitrogen element is promoted to fully react with the silicon element in the substrate to form a silicon-nitrogen bond with higher bonding energy. In the subsequent plasma process, the silicon-nitrogen bond is not easy to break under</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBw9vUPVsjMTUxPVShOzSvOL1JIzEtRKChKLUgsSizJzM9TyE0tychPUSjJSC1KzU_jYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqamRhYGpqaOxsSoAQAo5Srs</recordid><startdate>20221227</startdate><enddate>20221227</enddate><creator>JIANG HUIQIN</creator><creator>GUO ZHENQIANG</creator><creator>HE YACHUAN</creator><creator>HUANG PENG</creator><scope>EVB</scope></search><sort><creationdate>20221227</creationdate><title>CMOS image sensor and preparation method thereof</title><author>JIANG HUIQIN ; GUO ZHENQIANG ; HE YACHUAN ; HUANG PENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115528055A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG HUIQIN</creatorcontrib><creatorcontrib>GUO ZHENQIANG</creatorcontrib><creatorcontrib>HE YACHUAN</creatorcontrib><creatorcontrib>HUANG PENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG HUIQIN</au><au>GUO ZHENQIANG</au><au>HE YACHUAN</au><au>HUANG PENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CMOS image sensor and preparation method thereof</title><date>2022-12-27</date><risdate>2022</risdate><abstract>The invention provides a CMOS image sensor and a preparation method thereof, and the method comprises the steps: providing a substrate, forming a photodiode region and a floating diffusion region in the substrate, and forming a first well region in the photodiode region; respectively forming a second well region and a third well region in the photodiode region; forming a gate oxide layer and a gate electrode; forming a pinning layer on the surface of the third well region; carrying out nitrogen element doping on the surface of the substrate in the photodiode region; and executing a thermal annealing process. Nitrogen element doping is performed on the surface of the substrate, the thermal annealing process is performed to activate doped ions in the semiconductor structure, and the nitrogen element is promoted to fully react with the silicon element in the substrate to form a silicon-nitrogen bond with higher bonding energy. In the subsequent plasma process, the silicon-nitrogen bond is not easy to break under</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN115528055A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CMOS image sensor and preparation method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T16%3A13%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIANG%20HUIQIN&rft.date=2022-12-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115528055A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true