Processing device
The invention provides a processing apparatus which cleans a wider range of a processing chamber cover than fluid ejection from a nozzle. The processing apparatus includes: a chuck table that holds an object to be processed; a machining unit having a main shaft and machining the workpiece attracted...
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creator | HOSHIKAWA HIROTOSHI |
description | The invention provides a processing apparatus which cleans a wider range of a processing chamber cover than fluid ejection from a nozzle. The processing apparatus includes: a chuck table that holds an object to be processed; a machining unit having a main shaft and machining the workpiece attracted and held by the chuck table by using a machining tool attached to a lower end portion of the main shaft; a processing chamber cover having a top plate and side walls, the processing chamber cover covering the sides and the upper side of the chuck table and the processing tool; and a vibration imparting unit having a vibration element, the vibration imparting unit imparting vibrations to the side walls and the top plate of the processing chamber cover.
本发明提供加工装置,其与来自喷嘴的流体喷射相比对加工室罩的更宽的范围进行清洗。该加工装置具有:卡盘工作台,其对被加工物进行保持;加工单元,其具有主轴,利用安装于主轴的下端部的加工工具对卡盘工作台所吸引保持的被加工物进行加工;加工室罩,其具有顶板和侧壁,该加工室罩将卡盘工作台和加工工具的侧方以及上方覆盖;以及振动赋予单元,其具有振动元件,该振动赋予单元对加工室罩的侧壁和顶板赋予振动。 |
format | Patent |
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本发明提供加工装置,其与来自喷嘴的流体喷射相比对加工室罩的更宽的范围进行清洗。该加工装置具有:卡盘工作台,其对被加工物进行保持;加工单元,其具有主轴,利用安装于主轴的下端部的加工工具对卡盘工作台所吸引保持的被加工物进行加工;加工室罩,其具有顶板和侧壁,该加工室罩将卡盘工作台和加工工具的侧方以及上方覆盖;以及振动赋予单元,其具有振动元件,该振动赋予单元对加工室罩的侧壁和顶板赋予振动。</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221223&DB=EPODOC&CC=CN&NR=115502804A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221223&DB=EPODOC&CC=CN&NR=115502804A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSHIKAWA HIROTOSHI</creatorcontrib><title>Processing device</title><description>The invention provides a processing apparatus which cleans a wider range of a processing chamber cover than fluid ejection from a nozzle. The processing apparatus includes: a chuck table that holds an object to be processed; a machining unit having a main shaft and machining the workpiece attracted and held by the chuck table by using a machining tool attached to a lower end portion of the main shaft; a processing chamber cover having a top plate and side walls, the processing chamber cover covering the sides and the upper side of the chuck table and the processing tool; and a vibration imparting unit having a vibration element, the vibration imparting unit imparting vibrations to the side walls and the top plate of the processing chamber cover.
本发明提供加工装置,其与来自喷嘴的流体喷射相比对加工室罩的更宽的范围进行清洗。该加工装置具有:卡盘工作台,其对被加工物进行保持;加工单元,其具有主轴,利用安装于主轴的下端部的加工工具对卡盘工作台所吸引保持的被加工物进行加工;加工室罩,其具有顶板和侧壁,该加工室罩将卡盘工作台和加工工具的侧方以及上方覆盖;以及振动赋予单元,其具有振动元件,该振动赋予单元对加工室罩的侧壁和顶板赋予振动。</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMKMpPTi0uzsxLV0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGpqYGRhYGJo7GxKgBANU2H5k</recordid><startdate>20221223</startdate><enddate>20221223</enddate><creator>HOSHIKAWA HIROTOSHI</creator><scope>EVB</scope></search><sort><creationdate>20221223</creationdate><title>Processing device</title><author>HOSHIKAWA HIROTOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115502804A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSHIKAWA HIROTOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSHIKAWA HIROTOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Processing device</title><date>2022-12-23</date><risdate>2022</risdate><abstract>The invention provides a processing apparatus which cleans a wider range of a processing chamber cover than fluid ejection from a nozzle. The processing apparatus includes: a chuck table that holds an object to be processed; a machining unit having a main shaft and machining the workpiece attracted and held by the chuck table by using a machining tool attached to a lower end portion of the main shaft; a processing chamber cover having a top plate and side walls, the processing chamber cover covering the sides and the upper side of the chuck table and the processing tool; and a vibration imparting unit having a vibration element, the vibration imparting unit imparting vibrations to the side walls and the top plate of the processing chamber cover.
本发明提供加工装置,其与来自喷嘴的流体喷射相比对加工室罩的更宽的范围进行清洗。该加工装置具有:卡盘工作台,其对被加工物进行保持;加工单元,其具有主轴,利用安装于主轴的下端部的加工工具对卡盘工作台所吸引保持的被加工物进行加工;加工室罩,其具有顶板和侧壁,该加工室罩将卡盘工作台和加工工具的侧方以及上方覆盖;以及振动赋予单元,其具有振动元件,该振动赋予单元对加工室罩的侧壁和顶板赋予振动。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
title | Processing device |
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