Wafer jig structure and processing equipment causing high-temperature latent deformation

The invention provides a wafer jig structure and processing equipment for causing high-temperature latent deformation. The wafer jig structure mainly comprises two separable jigs. The first jig is provided with a first inclined plane, and the second jig is provided with another second inclined plane. And the first inclined surface and the second inclined surface are parallel to each other and are inclined to an external force applying direction simultaneously. When the first jig and the second jig abut against each other and the wafer is clamped between the first inclined surface and the second inclined surface, the chip is subjected to a shear stress component along the surface of the chip by applying external force. If an external force is operated at a high temperature, the wafer will have a high-temperature latent change. According to the inclined structure of the wafer jig and the auxiliary processing equipment, the wafer can be easily activated and high-temperature latent deformation can be developed by