Packaging structure and forming method of packaging structure
The invention discloses a packaging structure and a forming method of the packaging structure, and the structure comprises a wafer which is provided with a first surface and a second surface which are opposite to each other; the passivation layer is fixed on the surface of the side wall of the wafer...
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| creator | LIU ZAIFU ZENG ZHAOKONG GUO RUILIANG |
| description | The invention discloses a packaging structure and a forming method of the packaging structure, and the structure comprises a wafer which is provided with a first surface and a second surface which are opposite to each other; the passivation layer is fixed on the surface of the side wall of the wafer and is provided with a third surface and a fourth surface which are opposite to each other; a plurality of first connecting layers located in the passivation layer, wherein the first connecting layers penetrate through the passivation layer from the third surface to the fourth surface; the first electric connection structure is positioned on the third surface of the passivation layer and is electrically connected with the first connection layer; and the second electric connection structure is positioned on the fourth surface of the passivation layer and is electrically connected with the first connection layer. The packaging structure is high in packaging flexibility, and the area is saved.
一种封装结构及封装结构的形成方法，结构包括：晶 |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging structure and forming method of packaging structure |
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