SUBSTRATE CARRIER, FILM FORMING SYSTEM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
The invention provides a substrate carrier capable of suppressing peeling and vibration of a glass substrate, a film forming system, and a method for manufacturing an electronic device. A substrate carrier is provided with a plurality of substrate holders for holding and conveying a substrate vertic...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a substrate carrier capable of suppressing peeling and vibration of a glass substrate, a film forming system, and a method for manufacturing an electronic device. A substrate carrier is provided with a plurality of substrate holders for holding and conveying a substrate vertically downward by the plurality of substrate holders, the plurality of substrate holders including at least: a first substrate holder for adhering and holding the substrate; and a second substrate holder that adheres to and holds the substrate and has a higher shear rigidity than the first substrate holder, and in the substrate holding surface, the distance from the second substrate holder to the center of the substrate is shorter than the distance from the first substrate holder to the center of the substrate.
本发明提供一种能够抑制玻璃基板的剥离和振动的基板载体、成膜系统及电子器件的制造方法。基板载体具备多个基板保持件,用于通过多个基板保持件在铅垂方向下方保持并输送基板,其中,多个基板保持件至少包括:第1基板保持件,其粘附保持基板;以及第2基板保持件,其粘附保持基板,具有比第1基板保持件的剪切刚性高的剪切刚性,在基板保持面中,从第2基板保持件到基板的中心的距离比从第1基板保持件到基板的中心的距离短。 |
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