Epoxy resin composition for sealing semiconductor
Provided is an epoxy resin composition for sealing a semiconductor, which satisfies the characteristics required as a semiconductor sealing material, does not generate odor or SOx gas or NOx gas during combustion, emits fluorescence even at the long wavelength side of 390 nm or more, and can identif...
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| creator | HOSONO YOHEI SASAGE NOZOMU |
| description | Provided is an epoxy resin composition for sealing a semiconductor, which satisfies the characteristics required as a semiconductor sealing material, does not generate odor or SOx gas or NOx gas during combustion, emits fluorescence even at the long wavelength side of 390 nm or more, and can identify the type and manufacturer of a semiconductor device. The epoxy resin composition for sealing a semiconductor contains: (A) an epoxy resin; (B) at least one selected from the group consisting of a curing agent and a curing accelerator; and (C) a fluorescent agent having an anthracene structure.
提供一种半导体密封用环氧树脂组合物，其满足作为半导体密封材料所要求的特性，不产生臭味以及燃烧时的SOx气体和NOx气体，而且，即使在390nm以上的长波长侧也发出荧光，能够标识半导体装置的种类以及制造者。半导体密封用环氧树脂组合物含有：(A)环氧树脂；(B)选自于由固化剂和固化促进剂所组成的组中的至少1种；以及(C)具有蒽结构的荧光剂。 |
| format | Patent |
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提供一种半导体密封用环氧树脂组合物，其满足作为半导体密封材料所要求的特性，不产生臭味以及燃烧时的SOx气体和NOx气体，而且，即使在390nm以上的长波长侧也发出荧光，能够标识半导体装置的种类以及制造者。半导体密封用环氧树脂组合物含有：(A)环氧树脂；(B)选自于由固化剂和固化促进剂所组成的组中的至少1种；以及(C)具有蒽结构的荧光剂。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=CN&NR=115380075A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=CN&NR=115380075A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSONO YOHEI</creatorcontrib><creatorcontrib>SASAGE NOZOMU</creatorcontrib><title>Epoxy resin composition for sealing semiconductor</title><description>Provided is an epoxy resin composition for sealing a semiconductor, which satisfies the characteristics required as a semiconductor sealing material, does not generate odor or SOx gas or NOx gas during combustion, emits fluorescence even at the long wavelength side of 390 nm or more, and can identify the type and manufacturer of a semiconductor device. The epoxy resin composition for sealing a semiconductor contains: (A) an epoxy resin; (B) at least one selected from the group consisting of a curing agent and a curing accelerator; and (C) a fluorescent agent having an anthracene structure.
提供一种半导体密封用环氧树脂组合物，其满足作为半导体密封材料所要求的特性，不产生臭味以及燃烧时的SOx气体和NOx气体，而且，即使在390nm以上的长波长侧也发出荧光，能够标识半导体装置的种类以及制造者。半导体密封用环氧树脂组合物含有：(A)环氧树脂；(B)选自于由固化剂和固化促进剂所组成的组中的至少1种；以及(C)具有蒽结构的荧光剂。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0LcivqFQoSi3OzFNIzs8tyC_OLMnMz1NIyy9SKE5NzMnMSwfSuZnJ-Xkppckl-UU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0NTYwsDA3NTRmBg1ANZXLEc</recordid><startdate>20221122</startdate><enddate>20221122</enddate><creator>HOSONO YOHEI</creator><creator>SASAGE NOZOMU</creator><scope>EVB</scope></search><sort><creationdate>20221122</creationdate><title>Epoxy resin composition for sealing semiconductor</title><author>HOSONO YOHEI ; SASAGE NOZOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115380075A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSONO YOHEI</creatorcontrib><creatorcontrib>SASAGE NOZOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSONO YOHEI</au><au>SASAGE NOZOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Epoxy resin composition for sealing semiconductor</title><date>2022-11-22</date><risdate>2022</risdate><abstract>Provided is an epoxy resin composition for sealing a semiconductor, which satisfies the characteristics required as a semiconductor sealing material, does not generate odor or SOx gas or NOx gas during combustion, emits fluorescence even at the long wavelength side of 390 nm or more, and can identify the type and manufacturer of a semiconductor device. The epoxy resin composition for sealing a semiconductor contains: (A) an epoxy resin; (B) at least one selected from the group consisting of a curing agent and a curing accelerator; and (C) a fluorescent agent having an anthracene structure.
提供一种半导体密封用环氧树脂组合物，其满足作为半导体密封材料所要求的特性，不产生臭味以及燃烧时的SOx气体和NOx气体，而且，即使在390nm以上的长波长侧也发出荧光，能够标识半导体装置的种类以及制造者。半导体密封用环氧树脂组合物含有：(A)环氧树脂；(B)选自于由固化剂和固化促进剂所组成的组中的至少1种；以及(C)具有蒽结构的荧光剂。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Epoxy resin composition for sealing semiconductor |
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