Semiconductor device and forming method thereof

The invention provides a semiconductor device and a forming method thereof. The semiconductor device comprises a first substrate; the first device is positioned on the first substrate; the first dielectric layer and the first conductive plug are located on the first device; the first dielectric laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PENG XIAOMAO, GAN TAO, HOU YONGTIAN, WANG DAN, WANG YANXIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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