Plastic wafer processing method, plastic wafer, grating sheet and optical waveguide device
The embodiment of the invention discloses a plastic wafer processing method, a plastic wafer, a grating sheet and an optical waveguide device. The processing method comprises the following steps: forming an auxiliary surface on the surface of a plastic wafer through a plasma sputtering method; where...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The embodiment of the invention discloses a plastic wafer processing method, a plastic wafer, a grating sheet and an optical waveguide device. The processing method comprises the following steps: forming an auxiliary surface on the surface of a plastic wafer through a plasma sputtering method; wherein protective gas adopted by the plasma sputtering method comprises mixed gas of argon and oxygen; carrying out glue uniformizing treatment on the auxiliary surface, and forming an imprinting glue layer on the auxiliary surface; and manufacturing a nano-imprinting pattern on the imprinting glue layer. The processing method provided by the embodiment of the invention can be applied to the plastic wafer, and the adhesive force of the plastic wafer to the imprinting glue can be increased.
本申请实施例公开了一种塑料晶圆的处理方法、塑料晶圆、光栅片及光波导器件;所述处理方法包括:在塑料晶圆的表面上通过等离子体溅射法形成辅助表面;其中,所述等离子体溅射法采用的保护气体包括氩气和氧气的混合气体;对所述辅助表面进行匀胶处理,在所述辅助表面上形成压印胶层;在所述压印胶层上制作出纳米压印图案。本申请实施例的处理方法可应用于塑料晶圆,能够增加塑料晶圆对压印胶的附着力。 |
---|