Light-emitting diode packaging structure, manufacturing method thereof and light-emitting panel

The invention discloses a light-emitting diode packaging structure, a manufacturing method of the light-emitting diode packaging structure and a light-emitting panel. The light-emitting diode packaging structure comprises a first insulating layer, a first conductive pattern, a second insulating laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAN ZHIZHU, XIE HAOLUN, SUN SHUOYANG, LI XIAOYUN, CHEN FUYANG, WANG YOUZHI, ZHANG YUHAO, LAI YINGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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