Packaging structure for high-power and high-current device and preparation method of packaging structure

The invention relates to the technical field of integrated circuit packaging, in particular to a packaging structure for a high-power and high-current device and a preparation method of the packaging structure. The packaging structure comprises a ceramic substrate with an aluminum nitride multilayer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG NING, XIA MINGKUANG, GENG CHUNLEI, YANG ZHENGNAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!