Heat dissipation assembly, method for preparing heat dissipation assembly and electronic equipment

The invention discloses a heat dissipation assembly, a method for preparing the heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a liquid cooling plate, the interior of the liquid cooling plate is provided with a cooling liquid flow channel, and the liquid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GAO ZHIWEI, YANG PINGJIONG, WANG GUOHUI, GE YUNFEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!