Heat dissipation assembly, method for preparing heat dissipation assembly and electronic equipment
The invention discloses a heat dissipation assembly, a method for preparing the heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a liquid cooling plate, the interior of the liquid cooling plate is provided with a cooling liquid flow channel, and the liquid...
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| creator | GAO ZHIWEI YANG PINGJIONG WANG GUOHUI GE YUNFEI |
| description | The invention discloses a heat dissipation assembly, a method for preparing the heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a liquid cooling plate, the interior of the liquid cooling plate is provided with a cooling liquid flow channel, and the liquid cooling plate is provided with a cooling liquid inlet and a cooling liquid outlet which are communicated with the cooling liquid flow channel; the piezoelectric ceramic pump is arranged on one side of the liquid cooling plate, and the piezoelectric ceramic pump is provided with a pumping-in port and a pumping-out port; the connecting piece is located between the liquid cooling plate and the piezoelectric ceramic pump and used for connecting the liquid cooling plate and the piezoelectric ceramic pump, at least part of the liquid cooling plate is made of a metal material, the material forming the connecting piece is a high polymer material, and the part, making contact with the connecting piece, of the piezoelectric |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | Heat dissipation assembly, method for preparing heat dissipation assembly and electronic equipment |
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