Distributed multi-template high-precision printed board manufacturing method
The invention provides a distributed multi-template high-precision printed board manufacturing method. The distributed multi-template high-precision printed board manufacturing method comprises the steps of template design and manufacturing, hole drilling, hole metallization, pattern manufacturing,...
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| creator | WANG WEI ZHANG XIE CHEN XU SHANG JINGXIA ZHOU JUNSONG LIU JINFENG |
| description | The invention provides a distributed multi-template high-precision printed board manufacturing method. The distributed multi-template high-precision printed board manufacturing method comprises the steps of template design and manufacturing, hole drilling, hole metallization, pattern manufacturing, gold plating, positioning hole drilling and appearance punching. According to the invention, a distributed multi-template pattern transfer technology and a distributed independent pre-positioning punching appearance technology are adopted to replace a single template positioning and pre-drilling process flow in the prior art, so that the problems of low dimensional precision, poor batch precision consistency and the like caused by expansion and contraction deformation of materials are effectively improved; therefore, the manufactured printed board is high in size precision and good in batch consistency.
本发明提供了一种分布式多模板高精度印制板制作方法，包括：模板设计和制作、钻孔、孔金属化、图形制作、镀金、钻定位孔和冲制外形。本发明采用分布式多模版图形转移技术和分布式独立预定位冲制外形技术，取代原有技术中单一模板定位和预钻孔工 |
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本发明提供了一种分布式多模板高精度印制板制作方法，包括：模板设计和制作、钻孔、孔金属化、图形制作、镀金、钻定位孔和冲制外形。本发明采用分布式多模版图形转移技术和分布式独立预定位冲制外形技术，取代原有技术中单一模板定位和预钻孔工</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221108&DB=EPODOC&CC=CN&NR=115315078A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221108&DB=EPODOC&CC=CN&NR=115315078A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG WEI</creatorcontrib><creatorcontrib>ZHANG XIE</creatorcontrib><creatorcontrib>CHEN XU</creatorcontrib><creatorcontrib>SHANG JINGXIA</creatorcontrib><creatorcontrib>ZHOU JUNSONG</creatorcontrib><creatorcontrib>LIU JINFENG</creatorcontrib><title>Distributed multi-template high-precision printed board manufacturing method</title><description>The invention provides a distributed multi-template high-precision printed board manufacturing method. The distributed multi-template high-precision printed board manufacturing method comprises the steps of template design and manufacturing, hole drilling, hole metallization, pattern manufacturing, gold plating, positioning hole drilling and appearance punching. According to the invention, a distributed multi-template pattern transfer technology and a distributed independent pre-positioning punching appearance technology are adopted to replace a single template positioning and pre-drilling process flow in the prior art, so that the problems of low dimensional precision, poor batch precision consistency and the like caused by expansion and contraction deformation of materials are effectively improved; therefore, the manufactured printed board is high in size precision and good in batch consistency.
本发明提供了一种分布式多模板高精度印制板制作方法，包括：模板设计和制作、钻孔、孔金属化、图形制作、镀金、钻定位孔和冲制外形。本发明采用分布式多模版图形转移技术和分布式独立预定位冲制外形技术，取代原有技术中单一模板定位和预钻孔工</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyk0KwjAQQOFsXIh6h3iAgKEU3ZaquBBX7ss0nTYD-SOZ3N8KHsDVg8e3Fc8rFc40VsZJ-uqYFKNPDhilpcWqlNFQoRhkyhS-aoyQVwuhzmC4rneRHtnGaS82M7iCh1934ni_vfuHwhQHLAkMBuShf2ndNro9nS9d84_5ABA7NrQ</recordid><startdate>20221108</startdate><enddate>20221108</enddate><creator>WANG WEI</creator><creator>ZHANG XIE</creator><creator>CHEN XU</creator><creator>SHANG JINGXIA</creator><creator>ZHOU JUNSONG</creator><creator>LIU JINFENG</creator><scope>EVB</scope></search><sort><creationdate>20221108</creationdate><title>Distributed multi-template high-precision printed board manufacturing method</title><author>WANG WEI ; ZHANG XIE ; CHEN XU ; SHANG JINGXIA ; ZHOU JUNSONG ; LIU JINFENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115315078A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG WEI</creatorcontrib><creatorcontrib>ZHANG XIE</creatorcontrib><creatorcontrib>CHEN XU</creatorcontrib><creatorcontrib>SHANG JINGXIA</creatorcontrib><creatorcontrib>ZHOU JUNSONG</creatorcontrib><creatorcontrib>LIU JINFENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG WEI</au><au>ZHANG XIE</au><au>CHEN XU</au><au>SHANG JINGXIA</au><au>ZHOU JUNSONG</au><au>LIU JINFENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Distributed multi-template high-precision printed board manufacturing method</title><date>2022-11-08</date><risdate>2022</risdate><abstract>The invention provides a distributed multi-template high-precision printed board manufacturing method. The distributed multi-template high-precision printed board manufacturing method comprises the steps of template design and manufacturing, hole drilling, hole metallization, pattern manufacturing, gold plating, positioning hole drilling and appearance punching. According to the invention, a distributed multi-template pattern transfer technology and a distributed independent pre-positioning punching appearance technology are adopted to replace a single template positioning and pre-drilling process flow in the prior art, so that the problems of low dimensional precision, poor batch precision consistency and the like caused by expansion and contraction deformation of materials are effectively improved; therefore, the manufactured printed board is high in size precision and good in batch consistency.
本发明提供了一种分布式多模板高精度印制板制作方法，包括：模板设计和制作、钻孔、孔金属化、图形制作、镀金、钻定位孔和冲制外形。本发明采用分布式多模版图形转移技术和分布式独立预定位冲制外形技术，取代原有技术中单一模板定位和预钻孔工</abstract><oa>free_for_read</oa></addata></record> |
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| title | Distributed multi-template high-precision printed board manufacturing method |
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