Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg
The invention discloses a preparation method of a medium-temperature cured high-Tg low-bromine epoxy resin prepreg. The epoxy resin prepreg is formed by mixing a component A, a component B and a component C into glue and then coating the glue on glass fiber cloth to be cured at medium temperature, a...
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| creator | HAN CHANGXIN LI HUI WU JINGJING TIAN LI |
| description | The invention discloses a preparation method of a medium-temperature cured high-Tg low-bromine epoxy resin prepreg. The epoxy resin prepreg is formed by mixing a component A, a component B and a component C into glue and then coating the glue on glass fiber cloth to be cured at medium temperature, and the component A is a high-Tg low-bromine epoxy resin mixture modified by a modified coupling agent; the component B is a curing component solution containing an aromatic acid modification accelerant; and the component C is a composite filler reinforcement. Through surface modification of the high-Tg low-bromine epoxy resin by the modified coupling agent, chemical modification and intervention of the curing accelerator and dispersion pretreatment of the composite filler, the compatibility of the high-Tg low-bromine epoxy resin with the curing agent and the composite filler is greatly improved; the epoxy group and the curing agent with the active functional group are easily subjected to cross-linking reaction to f |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115304885A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115304885A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115304885A3</originalsourceid><addsrcrecordid>eNrjZAgLKEotSCxKLMnMz1PITS3JyE9RyE8DslIyS3N1S1JzC1KBkqVFqQrJQCJFISMzPUM3JF0hJ79cN6koPzczL1UhtSC_olKhKLU4M0-hAGhcUWo6DwNrWmJOcSovlOZmUHRzDXH20AWqjU8tLkhMTs1LLYl39jM0NDU2MLGwMHU0JkYNAE1YOes</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg</title><source>esp@cenet</source><creator>HAN CHANGXIN ; LI HUI ; WU JINGJING ; TIAN LI</creator><creatorcontrib>HAN CHANGXIN ; LI HUI ; WU JINGJING ; TIAN LI</creatorcontrib><description>The invention discloses a preparation method of a medium-temperature cured high-Tg low-bromine epoxy resin prepreg. The epoxy resin prepreg is formed by mixing a component A, a component B and a component C into glue and then coating the glue on glass fiber cloth to be cured at medium temperature, and the component A is a high-Tg low-bromine epoxy resin mixture modified by a modified coupling agent; the component B is a curing component solution containing an aromatic acid modification accelerant; and the component C is a composite filler reinforcement. Through surface modification of the high-Tg low-bromine epoxy resin by the modified coupling agent, chemical modification and intervention of the curing accelerator and dispersion pretreatment of the composite filler, the compatibility of the high-Tg low-bromine epoxy resin with the curing agent and the composite filler is greatly improved; the epoxy group and the curing agent with the active functional group are easily subjected to cross-linking reaction to f</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221108&DB=EPODOC&CC=CN&NR=115304885A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221108&DB=EPODOC&CC=CN&NR=115304885A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAN CHANGXIN</creatorcontrib><creatorcontrib>LI HUI</creatorcontrib><creatorcontrib>WU JINGJING</creatorcontrib><creatorcontrib>TIAN LI</creatorcontrib><title>Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg</title><description>The invention discloses a preparation method of a medium-temperature cured high-Tg low-bromine epoxy resin prepreg. The epoxy resin prepreg is formed by mixing a component A, a component B and a component C into glue and then coating the glue on glass fiber cloth to be cured at medium temperature, and the component A is a high-Tg low-bromine epoxy resin mixture modified by a modified coupling agent; the component B is a curing component solution containing an aromatic acid modification accelerant; and the component C is a composite filler reinforcement. Through surface modification of the high-Tg low-bromine epoxy resin by the modified coupling agent, chemical modification and intervention of the curing accelerator and dispersion pretreatment of the composite filler, the compatibility of the high-Tg low-bromine epoxy resin with the curing agent and the composite filler is greatly improved; the epoxy group and the curing agent with the active functional group are easily subjected to cross-linking reaction to f</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgLKEotSCxKLMnMz1PITS3JyE9RyE8DslIyS3N1S1JzC1KBkqVFqQrJQCJFISMzPUM3JF0hJ79cN6koPzczL1UhtSC_olKhKLU4M0-hAGhcUWo6DwNrWmJOcSovlOZmUHRzDXH20AWqjU8tLkhMTs1LLYl39jM0NDU2MLGwMHU0JkYNAE1YOes</recordid><startdate>20221108</startdate><enddate>20221108</enddate><creator>HAN CHANGXIN</creator><creator>LI HUI</creator><creator>WU JINGJING</creator><creator>TIAN LI</creator><scope>EVB</scope></search><sort><creationdate>20221108</creationdate><title>Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg</title><author>HAN CHANGXIN ; LI HUI ; WU JINGJING ; TIAN LI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115304885A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HAN CHANGXIN</creatorcontrib><creatorcontrib>LI HUI</creatorcontrib><creatorcontrib>WU JINGJING</creatorcontrib><creatorcontrib>TIAN LI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAN CHANGXIN</au><au>LI HUI</au><au>WU JINGJING</au><au>TIAN LI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg</title><date>2022-11-08</date><risdate>2022</risdate><abstract>The invention discloses a preparation method of a medium-temperature cured high-Tg low-bromine epoxy resin prepreg. The epoxy resin prepreg is formed by mixing a component A, a component B and a component C into glue and then coating the glue on glass fiber cloth to be cured at medium temperature, and the component A is a high-Tg low-bromine epoxy resin mixture modified by a modified coupling agent; the component B is a curing component solution containing an aromatic acid modification accelerant; and the component C is a composite filler reinforcement. Through surface modification of the high-Tg low-bromine epoxy resin by the modified coupling agent, chemical modification and intervention of the curing accelerator and dispersion pretreatment of the composite filler, the compatibility of the high-Tg low-bromine epoxy resin with the curing agent and the composite filler is greatly improved; the epoxy group and the curing agent with the active functional group are easily subjected to cross-linking reaction to f</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Preparation method of medium-temperature cured high-Tg low-bromine epoxy resin prepreg |
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