Power module
A power module (2) comprising a rigid insulating substrate (10) mounted on a substrate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the base plate (4) adjacent to the rigid insulating substrate (10). The stiffness of the additional circuit carrier (6, 8) is less than the stif...
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| creator | OLESEN KLAUS BECK MATTHIAS M ¨ 1 HLFELD, OLE ULRICH HOLGER BECKER MARTIN |
| description | A power module (2) comprising a rigid insulating substrate (10) mounted on a substrate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the base plate (4) adjacent to the rigid insulating substrate (10). The stiffness of the additional circuit carrier (6, 8) is less than the stiffness of the rigid insulating substrate (10).
披露了一种包括安装在基板(4)上的刚性绝缘衬底(10)的功率模块(2)。附加电路载体(6，8)与该刚性绝缘衬底(10)相邻地安装在该基板(4)上。该附加电路载体(6，8)的刚度小于该刚性绝缘衬底(10)的刚度。 |
| format | Patent |
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披露了一种包括安装在基板(4)上的刚性绝缘衬底(10)的功率模块(2)。附加电路载体(6，8)与该刚性绝缘衬底(10)相邻地安装在该基板(4)上。该附加电路载体(6，8)的刚度小于该刚性绝缘衬底(10)的刚度。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=CN&NR=115280495A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=CN&NR=115280495A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OLESEN KLAUS</creatorcontrib><creatorcontrib>BECK MATTHIAS</creatorcontrib><creatorcontrib>M ¨ 1 HLFELD, OLE</creatorcontrib><creatorcontrib>ULRICH HOLGER</creatorcontrib><creatorcontrib>BECKER MARTIN</creatorcontrib><title>Power module</title><description>A power module (2) comprising a rigid insulating substrate (10) mounted on a substrate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the base plate (4) adjacent to the rigid insulating substrate (10). The stiffness of the additional circuit carrier (6, 8) is less than the stiffness of the rigid insulating substrate (10).
披露了一种包括安装在基板(4)上的刚性绝缘衬底(10)的功率模块(2)。附加电路载体(6，8)与该刚性绝缘衬底(10)相邻地安装在该基板(4)上。该附加电路载体(6，8)的刚度小于该刚性绝缘衬底(10)的刚度。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAJyC9PLVLIzU8pzUnlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqZGFgYmlqaOxsSoAQAH9R2s</recordid><startdate>20221101</startdate><enddate>20221101</enddate><creator>OLESEN KLAUS</creator><creator>BECK MATTHIAS</creator><creator>M ¨ 1 HLFELD, OLE</creator><creator>ULRICH HOLGER</creator><creator>BECKER MARTIN</creator><scope>EVB</scope></search><sort><creationdate>20221101</creationdate><title>Power module</title><author>OLESEN KLAUS ; BECK MATTHIAS ; M ¨ 1 HLFELD, OLE ; ULRICH HOLGER ; BECKER MARTIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115280495A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OLESEN KLAUS</creatorcontrib><creatorcontrib>BECK MATTHIAS</creatorcontrib><creatorcontrib>M ¨ 1 HLFELD, OLE</creatorcontrib><creatorcontrib>ULRICH HOLGER</creatorcontrib><creatorcontrib>BECKER MARTIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OLESEN KLAUS</au><au>BECK MATTHIAS</au><au>M ¨ 1 HLFELD, OLE</au><au>ULRICH HOLGER</au><au>BECKER MARTIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power module</title><date>2022-11-01</date><risdate>2022</risdate><abstract>A power module (2) comprising a rigid insulating substrate (10) mounted on a substrate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the base plate (4) adjacent to the rigid insulating substrate (10). The stiffness of the additional circuit carrier (6, 8) is less than the stiffness of the rigid insulating substrate (10).
披露了一种包括安装在基板(4)上的刚性绝缘衬底(10)的功率模块(2)。附加电路载体(6，8)与该刚性绝缘衬底(10)相邻地安装在该基板(4)上。该附加电路载体(6，8)的刚度小于该刚性绝缘衬底(10)的刚度。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Power module |
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