Manufacturing method of pressure sensing module and pressure sensing module
The invention is suitable for the technical field of printed circuit boards, and provides a manufacturing method of a pressure sensing module, which comprises the following steps: providing a flexible circuit board and a daughter board, arranging a circuit board unit on the board surface of the flex...
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| creator | CHEN ZAOYI TANG QINGRU DU HONGDE KANG GUOQING LIU WEN WANG MING FANG YANFEI |
| description | The invention is suitable for the technical field of printed circuit boards, and provides a manufacturing method of a pressure sensing module, which comprises the following steps: providing a flexible circuit board and a daughter board, arranging a circuit board unit on the board surface of the flexible circuit board, and arranging a bonding pad in the circuit board unit; pasting an auxiliary film on the board surface of the flexible circuit board, wherein the auxiliary film covers at least part of the circuit board unit and exposes the bonding pad; a conductive bonding material is arranged on the bonding pad or the position, corresponding to the bonding pad, of the daughter board; the daughter board is attached to the circuit board unit, the auxiliary film is located between the daughter board and the circuit board unit, and the daughter board and the bonding pad are bonded through the conductive bonding material; the auxiliary film is removed, the pressure sensing module is obtained, and a gap is formed bet |
| format | Patent |
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pasting an auxiliary film on the board surface of the flexible circuit board, wherein the auxiliary film covers at least part of the circuit board unit and exposes the bonding pad; a conductive bonding material is arranged on the bonding pad or the position, corresponding to the bonding pad, of the daughter board; the daughter board is attached to the circuit board unit, the auxiliary film is located between the daughter board and the circuit board unit, and the daughter board and the bonding pad are bonded through the conductive bonding material; the auxiliary film is removed, the pressure sensing module is obtained, and a gap is formed bet</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221028&DB=EPODOC&CC=CN&NR=115250579A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221028&DB=EPODOC&CC=CN&NR=115250579A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN ZAOYI</creatorcontrib><creatorcontrib>TANG QINGRU</creatorcontrib><creatorcontrib>DU HONGDE</creatorcontrib><creatorcontrib>KANG GUOQING</creatorcontrib><creatorcontrib>LIU WEN</creatorcontrib><creatorcontrib>WANG MING</creatorcontrib><creatorcontrib>FANG YANFEI</creatorcontrib><title>Manufacturing method of pressure sensing module and pressure sensing module</title><description>The invention is suitable for the technical field of printed circuit boards, and provides a manufacturing method of a pressure sensing module, which comprises the following steps: providing a flexible circuit board and a daughter board, arranging a circuit board unit on the board surface of the flexible circuit board, and arranging a bonding pad in the circuit board unit; 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pasting an auxiliary film on the board surface of the flexible circuit board, wherein the auxiliary film covers at least part of the circuit board unit and exposes the bonding pad; a conductive bonding material is arranged on the bonding pad or the position, corresponding to the bonding pad, of the daughter board; the daughter board is attached to the circuit board unit, the auxiliary film is located between the daughter board and the circuit board unit, and the daughter board and the bonding pad are bonded through the conductive bonding material; the auxiliary film is removed, the pressure sensing module is obtained, and a gap is formed bet</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Manufacturing method of pressure sensing module and pressure sensing module |
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