COATED SUBSTRATES AND METHODS OF MAKING THE SAME
The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating deposited from a powder coating composition comprising a film-forming resin and optionally a thermally conductive, electrically insulating filler material and/or...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating deposited from a powder coating composition comprising a film-forming resin and optionally a thermally conductive, electrically insulating filler material and/or a cross-linking agent reactive with the film-forming resin, the powder coating composition is in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes curing of the powder coating composition, (ii) a component that is reactive with the film-forming resin and/or the crosslinking agent of the powder coating composition, and/or (iii) a rheology modifier.
本发明涉及一种基材,所述基材具有(a)施加到所述基材的至少一部分上的第一材料,和(b)由粉末涂料组合物沉积的涂层,所述粉末涂料组合物包括成膜树脂和任选地导热电绝缘填料材料和/或与所述成膜树脂具反应性的交联剂,所述粉末涂料组合物与已施加所述第一材料的所述基材的至少一部分直接接触。所述第一材料是(i)催化所述粉末涂料组合物固化的催化剂,(ii)与所述粉末涂料组合物的所述成膜树脂和/或所述交联剂具反应性的组分,和/或(iii)流变改性剂。 |
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