Silicon wafer production system

The embodiment of the invention provides a silicon wafer production system, and the system comprises a slicing machine which is used for cutting a silicon rod into silicon wafers, and placing the silicon wafers and a wafer support assembly in a tool basket; the conveying trolley is used for conveying the tool basket to the degumming device; the degumming device is internally provided with a staying space for accommodating the transportation trolley; the degumming device is used for carrying out degumming treatment and slicing treatment on the silicon wafer; the insertion washing device is used for carrying out wafer insertion on the silicon wafers subjected to wafer separation treatment; the tool basket comprises a tool basket frame and a side supporting assembly. An accommodating space for accommodating a silicon wafer is formed in the tool basket frame, and an opening for the silicon wafer to enter and exit from the accommodating space is formed in the top of the tool basket frame; the side supporting assem