Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method
The invention provides a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method, which can peel a substrate from a substrate stage in a short time without adversely affecting a display element region on the substrate. The subst...
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| creator | ZAITSU IKUHIRO GUAN YIQING HONDA ATSUO SHIMOMURA YOSHIO ARAI YUTAKA |
| description | The invention provides a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method, which can peel a substrate from a substrate stage in a short time without adversely affecting a display element region on the substrate. The substrate stripping device is used for stripping a substrate from a substrate carrying table (100) which is provided with a plurality of adsorption pads and is used for holding the substrate, and is characterized in that the substrate carrying table (100) is provided with a plurality of adsorption pads; the plurality of adsorption pads and the plurality of peeling portions for peeling the substrate are provided along the outer peripheral portion of the held substrate and the boundary portion corresponding to the display element region of the held substrate.
本发明提供一种不会给基板上的显示器元件区域带来不良影响且能够短时间地将基板从基板载台剥离的基板剥离装置、成膜装置、基板载台、基板剥离方法及成膜方法。该基板剥离装置从利用配设有多个的吸附垫对基板进行保持的基板载台(100)将所述基板剥离，其特征在于，在基板载台(100)，以分别沿着所保持的所述基板中的外周部和所保持的所述基板中的与 |
| format | Patent |
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本发明提供一种不会给基板上的显示器元件区域带来不良影响且能够短时间地将基板从基板载台剥离的基板剥离装置、成膜装置、基板载台、基板剥离方法及成膜方法。该基板剥离装置从利用配设有多个的吸附垫对基板进行保持的基板载台(100)将所述基板剥离，其特征在于，在基板载台(100)，以分别沿着所保持的所述基板中的外周部和所保持的所述基板中的与</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221021&DB=EPODOC&CC=CN&NR=115223913A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221021&DB=EPODOC&CC=CN&NR=115223913A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZAITSU IKUHIRO</creatorcontrib><creatorcontrib>GUAN YIQING</creatorcontrib><creatorcontrib>HONDA ATSUO</creatorcontrib><creatorcontrib>SHIMOMURA YOSHIO</creatorcontrib><creatorcontrib>ARAI YUTAKA</creatorcontrib><title>Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method</title><description>The invention provides a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method, which can peel a substrate from a substrate stage in a short time without adversely affecting a display element region on the substrate. The substrate stripping device is used for stripping a substrate from a substrate carrying table (100) which is provided with a plurality of adsorption pads and is used for holding the substrate, and is characterized in that the substrate carrying table (100) is provided with a plurality of adsorption pads; the plurality of adsorption pads and the plurality of peeling portions for peeling the substrate are provided along the outer peripheral portion of the held substrate and the boundary portion corresponding to the display element region of the held substrate.
本发明提供一种不会给基板上的显示器元件区域带来不良影响且能够短时间地将基板从基板载台剥离的基板剥离装置、成膜装置、基板载台、基板剥离方法及成膜方法。该基板剥离装置从利用配设有多个的吸附垫对基板进行保持的基板载台(100)将所述基板剥离，其特征在于，在基板载台(100)，以分别沿着所保持的所述基板中的外周部和所保持的所述基板中的与</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCgPLk0qLilKLElVKEhNzcnMS1dILChIBAqUFusopGXm5Cqk5RflookXwzUVlySmpyILwEzJTS3JyE_RUUjMS0E1BiLBw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDU2NjIwtDY0djYlRAwCnu0Yi</recordid><startdate>20221021</startdate><enddate>20221021</enddate><creator>ZAITSU IKUHIRO</creator><creator>GUAN YIQING</creator><creator>HONDA ATSUO</creator><creator>SHIMOMURA YOSHIO</creator><creator>ARAI YUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20221021</creationdate><title>Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method</title><author>ZAITSU IKUHIRO ; GUAN YIQING ; HONDA ATSUO ; SHIMOMURA YOSHIO ; ARAI YUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115223913A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ZAITSU IKUHIRO</creatorcontrib><creatorcontrib>GUAN YIQING</creatorcontrib><creatorcontrib>HONDA ATSUO</creatorcontrib><creatorcontrib>SHIMOMURA YOSHIO</creatorcontrib><creatorcontrib>ARAI YUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZAITSU IKUHIRO</au><au>GUAN YIQING</au><au>HONDA ATSUO</au><au>SHIMOMURA YOSHIO</au><au>ARAI YUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method</title><date>2022-10-21</date><risdate>2022</risdate><abstract>The invention provides a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method, which can peel a substrate from a substrate stage in a short time without adversely affecting a display element region on the substrate. The substrate stripping device is used for stripping a substrate from a substrate carrying table (100) which is provided with a plurality of adsorption pads and is used for holding the substrate, and is characterized in that the substrate carrying table (100) is provided with a plurality of adsorption pads; the plurality of adsorption pads and the plurality of peeling portions for peeling the substrate are provided along the outer peripheral portion of the held substrate and the boundary portion corresponding to the display element region of the held substrate.
本发明提供一种不会给基板上的显示器元件区域带来不良影响且能够短时间地将基板从基板载台剥离的基板剥离装置、成膜装置、基板载台、基板剥离方法及成膜方法。该基板剥离装置从利用配设有多个的吸附垫对基板进行保持的基板载台(100)将所述基板剥离，其特征在于，在基板载台(100)，以分别沿着所保持的所述基板中的外周部和所保持的所述基板中的与</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method |
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