Heat source device, substrate support device, and substrate processing facility
The invention relates to a heat source apparatus, a substrate support apparatus, and a substrate processing facility including the heat source apparatus and the substrate support apparatus. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber havi...
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| creator | NAM WON-SIK SONG DAE SEOK YEON KANG HEUM |
| description | The invention relates to a heat source apparatus, a substrate support apparatus, and a substrate processing facility including the heat source apparatus and the substrate support apparatus. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space in which the substrate is disposed, a substrate support device installed in the chamber to stably support the substrate, and a heat source device, the heat source device is installed in the chamber to uniformly heat the substrate.
本发明涉及一种热源装置、衬底支撑装置以及包括热源装置及衬底支撑装置的衬底处理设施。根据本发明，可通过腔室及衬底支撑装置以及热源装置对衬底进行均匀地加热且对衬底进行稳定地支撑，所述腔室具有在其中对衬底进行处置的内空间，所述衬底支撑装置安装在腔室中以对衬底进行稳定地支撑，所述热源装置安装在腔室中以对衬底进行均匀地加热。 |
| format | Patent |
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本发明涉及一种热源装置、衬底支撑装置以及包括热源装置及衬底支撑装置的衬底处理设施。根据本发明，可通过腔室及衬底支撑装置以及热源装置对衬底进行均匀地加热且对衬底进行稳定地支撑，所述腔室具有在其中对衬底进行处置的内空间，所述衬底支撑装置安装在腔室中以对衬底进行稳定地支撑，所述热源装置安装在腔室中以对衬底进行均匀地加热。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221021&DB=EPODOC&CC=CN&NR=115223891A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221021&DB=EPODOC&CC=CN&NR=115223891A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAM WON-SIK</creatorcontrib><creatorcontrib>SONG DAE SEOK</creatorcontrib><creatorcontrib>YEON KANG HEUM</creatorcontrib><title>Heat source device, substrate support device, and substrate processing facility</title><description>The invention relates to a heat source apparatus, a substrate support apparatus, and a substrate processing facility including the heat source apparatus and the substrate support apparatus. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space in which the substrate is disposed, a substrate support device installed in the chamber to stably support the substrate, and a heat source device, the heat source device is installed in the chamber to uniformly heat the substrate.
本发明涉及一种热源装置、衬底支撑装置以及包括热源装置及衬底支撑装置的衬底处理设施。根据本发明，可通过腔室及衬底支撑装置以及热源装置对衬底进行均匀地加热且对衬底进行稳定地支撑，所述腔室具有在其中对衬底进行处置的内空间，所述衬底支撑装置安装在腔室中以对衬底进行稳定地支撑，所述热源装置安装在腔室中以对衬底进行均匀地加热。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD3SE0sUSjOLy1KTlVISS3LTE7VUSguTSouKUosSQWyCgryi0rgMol5KUiyBUX5yanFxZl56QppicmZOZkllTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DQ1MjI2MLS0NGYGDUAcGg3PQ</recordid><startdate>20221021</startdate><enddate>20221021</enddate><creator>NAM WON-SIK</creator><creator>SONG DAE SEOK</creator><creator>YEON KANG HEUM</creator><scope>EVB</scope></search><sort><creationdate>20221021</creationdate><title>Heat source device, substrate support device, and substrate processing facility</title><author>NAM WON-SIK ; SONG DAE SEOK ; YEON KANG HEUM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115223891A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAM WON-SIK</creatorcontrib><creatorcontrib>SONG DAE SEOK</creatorcontrib><creatorcontrib>YEON KANG HEUM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAM WON-SIK</au><au>SONG DAE SEOK</au><au>YEON KANG HEUM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat source device, substrate support device, and substrate processing facility</title><date>2022-10-21</date><risdate>2022</risdate><abstract>The invention relates to a heat source apparatus, a substrate support apparatus, and a substrate processing facility including the heat source apparatus and the substrate support apparatus. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space in which the substrate is disposed, a substrate support device installed in the chamber to stably support the substrate, and a heat source device, the heat source device is installed in the chamber to uniformly heat the substrate.
本发明涉及一种热源装置、衬底支撑装置以及包括热源装置及衬底支撑装置的衬底处理设施。根据本发明，可通过腔室及衬底支撑装置以及热源装置对衬底进行均匀地加热且对衬底进行稳定地支撑，所述腔室具有在其中对衬底进行处置的内空间，所述衬底支撑装置安装在腔室中以对衬底进行稳定地支撑，所述热源装置安装在腔室中以对衬底进行均匀地加热。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Heat source device, substrate support device, and substrate processing facility |
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