Cooling area forced cooling device for vacuum reflow soldering furnace

The invention discloses a cooling area forced cooling device for a vacuum reflow soldering furnace, which comprises a device mounting frame, a reflow soldering furnace heating area is arranged on one side of the top of the device mounting frame, and a reflow soldering furnace cooling area is arrange...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU ZEHUA, XUE JIANGUANG, KANG CHANG-DONG, CHEN YUANMING, KE CHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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