Fluoropolymer, resin film, and optoelectronic element
Provided is a fluorine-containing polymer which is suitable for vapor deposition and is capable of appropriately performing metal patterning. Also provided is a resin film comprising such a fluoropolymer as a material. Also provided is an optoelectronic element having such a resin film in the struct...
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| creator | TAKEI SAKI BEPPU, SHOTARO ABE TAKEFUMI TSURUOKA KAORI SHIMOHIRA, TETSUJI |
| description | Provided is a fluorine-containing polymer which is suitable for vapor deposition and is capable of appropriately performing metal patterning. Also provided is a resin film comprising such a fluoropolymer as a material. Also provided is an optoelectronic element having such a resin film in the structure. The fluorine-containing polymer satisfies the following requirements (1) to (3). (1) The melting point is lower than 200 DEG C or cannot be observed. (2) The thermal weight loss ratio when the temperature is increased at a temperature increase rate of 2 DEG C/min at a pressure of 1 * 10-3 Pa is not more than 400 DEG C and substantially 100%. And (3) the temperature range from the temperature at which the thermal weight loss ratio becomes 10% to the temperature at which the thermal weight loss ratio becomes 90% is within 200 DEG C when the temperature is increased at a temperature increase rate of 2 DEG C/min under a pressure of 1 * 10-3 Pa.
提供适合于蒸镀、能够适当地进行金属图案化的含氟聚合物。另外，提供包含这种含氟聚合物作为材料的树脂膜。另外，提供在结构中具有这种树脂膜的光电子 |
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提供适合于蒸镀、能够适当地进行金属图案化的含氟聚合物。另外，提供包含这种含氟聚合物作为材料的树脂膜。另外，提供在结构中具有这种树脂膜的光电子</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221014&DB=EPODOC&CC=CN&NR=115191151A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221014&DB=EPODOC&CC=CN&NR=115191151A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEI SAKI</creatorcontrib><creatorcontrib>BEPPU, SHOTARO</creatorcontrib><creatorcontrib>ABE TAKEFUMI</creatorcontrib><creatorcontrib>TSURUOKA KAORI</creatorcontrib><creatorcontrib>SHIMOHIRA, TETSUJI</creatorcontrib><title>Fluoropolymer, resin film, and optoelectronic element</title><description>Provided is a fluorine-containing polymer which is suitable for vapor deposition and is capable of appropriately performing metal patterning. Also provided is a resin film comprising such a fluoropolymer as a material. Also provided is an optoelectronic element having such a resin film in the structure. The fluorine-containing polymer satisfies the following requirements (1) to (3). (1) The melting point is lower than 200 DEG C or cannot be observed. (2) The thermal weight loss ratio when the temperature is increased at a temperature increase rate of 2 DEG C/min at a pressure of 1 * 10-3 Pa is not more than 400 DEG C and substantially 100%. And (3) the temperature range from the temperature at which the thermal weight loss ratio becomes 10% to the temperature at which the thermal weight loss ratio becomes 90% is within 200 DEG C when the temperature is increased at a temperature increase rate of 2 DEG C/min under a pressure of 1 * 10-3 Pa.
提供适合于蒸镀、能够适当地进行金属图案化的含氟聚合物。另外，提供包含这种含氟聚合物作为材料的树脂膜。另外，提供在结构中具有这种树脂膜的光电子</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB1yynNL8ovyM-pzE0t0lEoSi3OzFNIy8zJ1VFIzEtRyC8oyU_NSU0uKcrPy0xWADJzU_NKeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGpoSWIcDQmRg0Af8ktVQ</recordid><startdate>20221014</startdate><enddate>20221014</enddate><creator>TAKEI SAKI</creator><creator>BEPPU, SHOTARO</creator><creator>ABE TAKEFUMI</creator><creator>TSURUOKA KAORI</creator><creator>SHIMOHIRA, TETSUJI</creator><scope>EVB</scope></search><sort><creationdate>20221014</creationdate><title>Fluoropolymer, resin film, and optoelectronic element</title><author>TAKEI SAKI ; BEPPU, SHOTARO ; ABE TAKEFUMI ; TSURUOKA KAORI ; SHIMOHIRA, TETSUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115191151A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEI SAKI</creatorcontrib><creatorcontrib>BEPPU, SHOTARO</creatorcontrib><creatorcontrib>ABE TAKEFUMI</creatorcontrib><creatorcontrib>TSURUOKA KAORI</creatorcontrib><creatorcontrib>SHIMOHIRA, TETSUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEI SAKI</au><au>BEPPU, SHOTARO</au><au>ABE TAKEFUMI</au><au>TSURUOKA KAORI</au><au>SHIMOHIRA, TETSUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fluoropolymer, resin film, and optoelectronic element</title><date>2022-10-14</date><risdate>2022</risdate><abstract>Provided is a fluorine-containing polymer which is suitable for vapor deposition and is capable of appropriately performing metal patterning. Also provided is a resin film comprising such a fluoropolymer as a material. Also provided is an optoelectronic element having such a resin film in the structure. The fluorine-containing polymer satisfies the following requirements (1) to (3). (1) The melting point is lower than 200 DEG C or cannot be observed. (2) The thermal weight loss ratio when the temperature is increased at a temperature increase rate of 2 DEG C/min at a pressure of 1 * 10-3 Pa is not more than 400 DEG C and substantially 100%. And (3) the temperature range from the temperature at which the thermal weight loss ratio becomes 10% to the temperature at which the thermal weight loss ratio becomes 90% is within 200 DEG C when the temperature is increased at a temperature increase rate of 2 DEG C/min under a pressure of 1 * 10-3 Pa.
提供适合于蒸镀、能够适当地进行金属图案化的含氟聚合物。另外，提供包含这种含氟聚合物作为材料的树脂膜。另外，提供在结构中具有这种树脂膜的光电子</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Fluoropolymer, resin film, and optoelectronic element |
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