Heat pump
The present disclosure includes: a first duct in which a first refrigerant flows; a second duct disposed on one side of the first duct and in which a second refrigerant flows; the first heat exchanger is connected with the first pipeline and the second pipeline, and the first refrigerant and the sec...
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Hauptverfasser: | , , , |
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Format: | Patent |
Sprache: | chi ; eng |
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