Heat pump

The present disclosure includes: a first duct in which a first refrigerant flows; a second duct disposed on one side of the first duct and in which a second refrigerant flows; the first heat exchanger is connected with the first pipeline and the second pipeline, and the first refrigerant and the sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE YOUNG-MIN, CHO EUNJUN, KIM MIN-SOO, YOO JI-HYUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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