Feeding device of wafer cutting machine

The invention relates to the technical field of wafer cutting machines, in particular to a feeding device of a wafer cutting machine. The device comprises an upper material plate, a lower material plate and a side plate, the upper material plate is a raw material placing area, the upper material pla...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN JIANGQIANG, WEI YUHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	PERFORMING OPERATIONS TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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