Feeding device of wafer cutting machine

Feeding device of wafer cutting machine

The invention relates to the technical field of wafer cutting machines, in particular to a feeding device of a wafer cutting machine. The device comprises an upper material plate, a lower material plate and a side plate, the upper material plate is a raw material placing area, the upper material pla...

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Hauptverfasser: TAN JIANGQIANG, WEI YUHONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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creator TAN JIANGQIANG
WEI YUHONG
description The invention relates to the technical field of wafer cutting machines, in particular to a feeding device of a wafer cutting machine. The device comprises an upper material plate, a lower material plate and a side plate, the upper material plate is a raw material placing area, the upper material plate, the lower material plate and the side plate form a drawer, and an inner side opening of the drawer is used for moving a wafer into the drawer; the upper material plate has a wafer feeding function and also has a function of outputting wafers for inspection, when a certain wafer needs to be inspected during production and processing, the wafer is transferred into a drawer through a manipulator, an operator opens a drawer door and takes the wafer out of the drawer for inspection, the operation is very convenient, production is not influenced, and the production efficiency is improved. And the safety is high. 本发明涉及晶圆切割机技术领域，特指一种晶圆切割机进料装置；本发明包括上物料板、下物料板、侧板，上物料板为原料放置区域，上物料板、下物料板、侧板形成抽屉，抽屉的内侧开口用于将晶圆移入抽屉内；本发明的上物料板具有晶圆
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subjects PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
title Feeding device of wafer cutting machine
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