Multi-base-island lead frame and chip packaging method
The invention discloses a multi-base-island lead frame and a packaging method, and relates to the technical field of semiconductor packaging. The method and the device are used for solving the problems that an existing single base island is large in area and weak in strength due to the fact that a p...
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| creator | WANG YANRONG GUO XIAOWEI GUO LINGZHI LI WANXIA LYU HAILAN |
| description | The invention discloses a multi-base-island lead frame and a packaging method, and relates to the technical field of semiconductor packaging. The method and the device are used for solving the problems that an existing single base island is large in area and weak in strength due to the fact that a plurality of chips are arranged, and the number of Leads on the edge of the base island is insufficient. Comprising a first base island used for arranging a control chip; at least two second base islands, each second base island is provided with a second chip, the two second base islands with the same signal are connected through a base island connection area, and the base island connection area is provided with a through hole; wherein two second base islands of a second chip with the same signal are respectively arranged, the second base islands have the same signal, and the first base island is electrically connected with each second base island.
本发明公开了多基岛引线框架及封装方法，涉及半导体封装技术领域。用以解决现有的单个基岛因设置多个芯片存在面积较大、强度较弱，导致基岛边缘L |
| format | Patent |
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本发明公开了多基岛引线框架及封装方法，涉及半导体封装技术领域。用以解决现有的单个基岛因设置多个芯片存在面积较大、强度较弱，导致基岛边缘L</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220930&DB=EPODOC&CC=CN&NR=115132691A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220930&DB=EPODOC&CC=CN&NR=115132691A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG YANRONG</creatorcontrib><creatorcontrib>GUO XIAOWEI</creatorcontrib><creatorcontrib>GUO LINGZHI</creatorcontrib><creatorcontrib>LI WANXIA</creatorcontrib><creatorcontrib>LYU HAILAN</creatorcontrib><title>Multi-base-island lead frame and chip packaging method</title><description>The invention discloses a multi-base-island lead frame and a packaging method, and relates to the technical field of semiconductor packaging. The method and the device are used for solving the problems that an existing single base island is large in area and weak in strength due to the fact that a plurality of chips are arranged, and the number of Leads on the edge of the base island is insufficient. Comprising a first base island used for arranging a control chip; at least two second base islands, each second base island is provided with a second chip, the two second base islands with the same signal are connected through a base island connection area, and the base island connection area is provided with a through hole; wherein two second base islands of a second chip with the same signal are respectively arranged, the second base islands have the same signal, and the first base island is electrically connected with each second base island.
本发明公开了多基岛引线框架及封装方法，涉及半导体封装技术领域。用以解决现有的单个基岛因设置多个芯片存在面积较大、强度较弱，导致基岛边缘L</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDzLc0pydRNSixO1c0szknMS1HISU1MUUgrSsxNVQBxkzMyCxQKEpOzE9Mz89IVclNLMvJTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58ajFQeWpeakm8s5-hoamhsZGZpaGjMTFqAFe8LPA</recordid><startdate>20220930</startdate><enddate>20220930</enddate><creator>WANG YANRONG</creator><creator>GUO XIAOWEI</creator><creator>GUO LINGZHI</creator><creator>LI WANXIA</creator><creator>LYU HAILAN</creator><scope>EVB</scope></search><sort><creationdate>20220930</creationdate><title>Multi-base-island lead frame and chip packaging method</title><author>WANG YANRONG ; GUO XIAOWEI ; GUO LINGZHI ; LI WANXIA ; LYU HAILAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115132691A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG YANRONG</creatorcontrib><creatorcontrib>GUO XIAOWEI</creatorcontrib><creatorcontrib>GUO LINGZHI</creatorcontrib><creatorcontrib>LI WANXIA</creatorcontrib><creatorcontrib>LYU HAILAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG YANRONG</au><au>GUO XIAOWEI</au><au>GUO LINGZHI</au><au>LI WANXIA</au><au>LYU HAILAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-base-island lead frame and chip packaging method</title><date>2022-09-30</date><risdate>2022</risdate><abstract>The invention discloses a multi-base-island lead frame and a packaging method, and relates to the technical field of semiconductor packaging. The method and the device are used for solving the problems that an existing single base island is large in area and weak in strength due to the fact that a plurality of chips are arranged, and the number of Leads on the edge of the base island is insufficient. Comprising a first base island used for arranging a control chip; at least two second base islands, each second base island is provided with a second chip, the two second base islands with the same signal are connected through a base island connection area, and the base island connection area is provided with a through hole; wherein two second base islands of a second chip with the same signal are respectively arranged, the second base islands have the same signal, and the first base island is electrically connected with each second base island.
本发明公开了多基岛引线框架及封装方法，涉及半导体封装技术领域。用以解决现有的单个基岛因设置多个芯片存在面积较大、强度较弱，导致基岛边缘L</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Multi-base-island lead frame and chip packaging method |
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