High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device
The invention discloses a high-speed LED device giving consideration to positioning and illumination and a preparation method thereof.The LED device comprises an LED circuit, an RLC bypass and a packaging substrate, the LED circuit comprises a plurality of LED chips, the wavelengths of the LED chips...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WANG GUANGXU WANG LI YANAGI YUTAKA ZHANG JIANLI GUO XING |
| description | The invention discloses a high-speed LED device giving consideration to positioning and illumination and a preparation method thereof.The LED device comprises an LED circuit, an RLC bypass and a packaging substrate, the LED circuit comprises a plurality of LED chips, the wavelengths of the LED chips are not less than two, the LED circuit comprises at least two independently-controlled LED sub-circuits, the wavelengths of the LED chips on the same LED sub-circuit are the same, and the RLC bypass is connected with the packaging substrate. At least one LED sub-circuit is connected in parallel with an RLC bypass, the RLC bypass comprises a resistor R, an inductor L and a capacitor C which are connected in series, and the resistor R, the inductor L and the capacitor C and the LED sub-circuits are respectively fixed on the packaging substrate to form electrical connection. According to the invention, the two ends of the LED are connected in parallel with the RLC bypass, so that the modulation bandwidth of the LED i |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115119355A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115119355A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115119355A3</originalsourceid><addsrcrecordid>eNqNjbEKwjAURbs4iPoPzw_oEEoGR2krHcTJvYTkNXmQ5oUmdvDrJdjRwele7jlw99V7IOvqFBEN3PsODK6kESytFCxoDokMLioTB8gMkROVXqAKBsj710zhy8sQF4xq82fMjg3wBO7XybHaTconPG15qM63_tkONUYeMUWlMWAe24cQUohLI-W1-cf5AAGQRmc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device</title><source>esp@cenet</source><creator>WANG GUANGXU ; WANG LI ; YANAGI YUTAKA ; ZHANG JIANLI ; GUO XING</creator><creatorcontrib>WANG GUANGXU ; WANG LI ; YANAGI YUTAKA ; ZHANG JIANLI ; GUO XING</creatorcontrib><description>The invention discloses a high-speed LED device giving consideration to positioning and illumination and a preparation method thereof.The LED device comprises an LED circuit, an RLC bypass and a packaging substrate, the LED circuit comprises a plurality of LED chips, the wavelengths of the LED chips are not less than two, the LED circuit comprises at least two independently-controlled LED sub-circuits, the wavelengths of the LED chips on the same LED sub-circuit are the same, and the RLC bypass is connected with the packaging substrate. At least one LED sub-circuit is connected in parallel with an RLC bypass, the RLC bypass comprises a resistor R, an inductor L and a capacitor C which are connected in series, and the resistor R, the inductor L and the capacitor C and the LED sub-circuits are respectively fixed on the packaging substrate to form electrical connection. According to the invention, the two ends of the LED are connected in parallel with the RLC bypass, so that the modulation bandwidth of the LED i</description><language>chi ; eng</language><subject>BLASTING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR ; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL ; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE ; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS ; LIGHTING ; MECHANICAL ENGINEERING ; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE ; TRANSMISSION ; WEAPONS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=CN&NR=115119355A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=CN&NR=115119355A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG GUANGXU</creatorcontrib><creatorcontrib>WANG LI</creatorcontrib><creatorcontrib>YANAGI YUTAKA</creatorcontrib><creatorcontrib>ZHANG JIANLI</creatorcontrib><creatorcontrib>GUO XING</creatorcontrib><title>High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device</title><description>The invention discloses a high-speed LED device giving consideration to positioning and illumination and a preparation method thereof.The LED device comprises an LED circuit, an RLC bypass and a packaging substrate, the LED circuit comprises a plurality of LED chips, the wavelengths of the LED chips are not less than two, the LED circuit comprises at least two independently-controlled LED sub-circuits, the wavelengths of the LED chips on the same LED sub-circuit are the same, and the RLC bypass is connected with the packaging substrate. At least one LED sub-circuit is connected in parallel with an RLC bypass, the RLC bypass comprises a resistor R, an inductor L and a capacitor C which are connected in series, and the resistor R, the inductor L and the capacitor C and the LED sub-circuits are respectively fixed on the packaging substrate to form electrical connection. According to the invention, the two ends of the LED are connected in parallel with the RLC bypass, so that the modulation bandwidth of the LED i</description><subject>BLASTING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</subject><subject>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</subject><subject>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</subject><subject>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</subject><subject>TRANSMISSION</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwjAURbs4iPoPzw_oEEoGR2krHcTJvYTkNXmQ5oUmdvDrJdjRwele7jlw99V7IOvqFBEN3PsODK6kESytFCxoDokMLioTB8gMkROVXqAKBsj710zhy8sQF4xq82fMjg3wBO7XybHaTconPG15qM63_tkONUYeMUWlMWAe24cQUohLI-W1-cf5AAGQRmc</recordid><startdate>20220927</startdate><enddate>20220927</enddate><creator>WANG GUANGXU</creator><creator>WANG LI</creator><creator>YANAGI YUTAKA</creator><creator>ZHANG JIANLI</creator><creator>GUO XING</creator><scope>EVB</scope></search><sort><creationdate>20220927</creationdate><title>High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device</title><author>WANG GUANGXU ; WANG LI ; YANAGI YUTAKA ; ZHANG JIANLI ; GUO XING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115119355A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BLASTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</topic><topic>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</topic><topic>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</topic><topic>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</topic><topic>TRANSMISSION</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG GUANGXU</creatorcontrib><creatorcontrib>WANG LI</creatorcontrib><creatorcontrib>YANAGI YUTAKA</creatorcontrib><creatorcontrib>ZHANG JIANLI</creatorcontrib><creatorcontrib>GUO XING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG GUANGXU</au><au>WANG LI</au><au>YANAGI YUTAKA</au><au>ZHANG JIANLI</au><au>GUO XING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device</title><date>2022-09-27</date><risdate>2022</risdate><abstract>The invention discloses a high-speed LED device giving consideration to positioning and illumination and a preparation method thereof.The LED device comprises an LED circuit, an RLC bypass and a packaging substrate, the LED circuit comprises a plurality of LED chips, the wavelengths of the LED chips are not less than two, the LED circuit comprises at least two independently-controlled LED sub-circuits, the wavelengths of the LED chips on the same LED sub-circuit are the same, and the RLC bypass is connected with the packaging substrate. At least one LED sub-circuit is connected in parallel with an RLC bypass, the RLC bypass comprises a resistor R, an inductor L and a capacitor C which are connected in series, and the resistor R, the inductor L and the capacitor C and the LED sub-circuits are respectively fixed on the packaging substrate to form electrical connection. According to the invention, the two ends of the LED are connected in parallel with the RLC bypass, so that the modulation bandwidth of the LED i</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN115119355A |
| source | esp@cenet |
| subjects | BLASTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE TRANSMISSION WEAPONS |
| title | High-speed LED device giving consideration to positioning and illumination and preparation method of high-speed LED device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T21%3A47%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20GUANGXU&rft.date=2022-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115119355A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |