SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus (1) is provided with a processing liquid tank (30), a first circulation pipe (31), a filter (39), a pump (37), and a control unit (3A). The upstream end (31a) of the first circ...
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| creator | AOKI RIKUTA AIHARA TOMOAKI MIZUKAMI DAIJO |
| description | The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus (1) is provided with a processing liquid tank (30), a first circulation pipe (31), a filter (39), a pump (37), and a control unit (3A). The upstream end (31a) of the first circulation pipe (31) is connected to the processing liquid tank (30), and the downstream end (31b) of the first circulation pipe (31) is connected to the processing liquid tank (30), thereby circulating the processing liquid. The filter (39) is disposed in the first circulation pipe (31) and captures particles contained in the processing liquid. The pump (37) is disposed in the first circulation pipe (31). The pump (37) has a rotating body (371), and conveys the processing liquid by rotating the rotating body (371). When driving the pump (37) in a stopped state, the control unit (3A) controls the pump (37) such that the rotating body (371) rotates at a rotational acceleration of 400 rpm/sec or less.
本发明提供基板处理装置及基板处理方法 |
| format | Patent |
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本发明提供基板处理装置及基板处理方法</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SEPARATION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDU0NDc0sLA0djYlRAwCaOiqg</recordid><startdate>20220927</startdate><enddate>20220927</enddate><creator>AOKI RIKUTA</creator><creator>AIHARA TOMOAKI</creator><creator>MIZUKAMI DAIJO</creator><scope>EVB</scope></search><sort><creationdate>20220927</creationdate><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><author>AOKI RIKUTA ; AIHARA TOMOAKI ; MIZUKAMI DAIJO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115116891A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SEPARATION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AOKI RIKUTA</creatorcontrib><creatorcontrib>AIHARA TOMOAKI</creatorcontrib><creatorcontrib>MIZUKAMI DAIJO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOKI RIKUTA</au><au>AIHARA TOMOAKI</au><au>MIZUKAMI DAIJO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><date>2022-09-27</date><risdate>2022</risdate><abstract>The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus (1) is provided with a processing liquid tank (30), a first circulation pipe (31), a filter (39), a pump (37), and a control unit (3A). The upstream end (31a) of the first circulation pipe (31) is connected to the processing liquid tank (30), and the downstream end (31b) of the first circulation pipe (31) is connected to the processing liquid tank (30), thereby circulating the processing liquid. The filter (39) is disposed in the first circulation pipe (31) and captures particles contained in the processing liquid. The pump (37) is disposed in the first circulation pipe (31). The pump (37) has a rotating body (371), and conveys the processing liquid by rotating the rotating body (371). When driving the pump (37) in a stopped state, the control unit (3A) controls the pump (37) such that the rotating body (371) rotates at a rotational acceleration of 400 rpm/sec or less.
本发明提供基板处理装置及基板处理方法</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SEPARATION TRANSPORTING |
| title | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
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