Method for testing expansion and contraction of circuit board

The invention discloses an expansion and shrinkage test method of a circuit board. The method comprises the following steps: obtaining theoretical processing data of a test copper-clad plate; processing a test copper-clad plate based on the theoretical processing data, and obtaining actual processin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN QINGCHUAN, WU ZENONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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