Flexible circuit board laser cutting equipment
The invention discloses flexible circuit board laser cutting equipment which comprises a base frame, an air cylinder, a laser cutter, a dust removal device, a sealing device, a pressing device, a clamping groove, a circuit board and a pressing winding device. The air cylinder is arranged on the base...
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| creator | CHEN MINGQIN LEI XINGHUA XIA YUHAI CAI YACHAO |
| description | The invention discloses flexible circuit board laser cutting equipment which comprises a base frame, an air cylinder, a laser cutter, a dust removal device, a sealing device, a pressing device, a clamping groove, a circuit board and a pressing winding device. The air cylinder is arranged on the base frame, the laser cutter is arranged at the output end of the air cylinder, and the dust removal device is arranged at the output end of the air cylinder and located around the laser cutter; the sealing device is arranged on the dust removal device, the pressing device is arranged on the base frame, the clamping groove is formed in the bottom of the base frame, the circuit board is arranged in the clamping groove in a transmission mode and can be pressed by the pressing device, and the pressing winding device is arranged on the base frame. The invention belongs to the technical field of circuit board production, and particularly relates to flexible circuit board laser cutting equipment which can press and fix a cir |
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The air cylinder is arranged on the base frame, the laser cutter is arranged at the output end of the air cylinder, and the dust removal device is arranged at the output end of the air cylinder and located around the laser cutter; the sealing device is arranged on the dust removal device, the pressing device is arranged on the base frame, the clamping groove is formed in the bottom of the base frame, the circuit board is arranged in the clamping groove in a transmission mode and can be pressed by the pressing device, and the pressing winding device is arranged on the base frame. The invention belongs to the technical field of circuit board production, and particularly relates to flexible circuit board laser cutting equipment which can press and fix a cir</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220923&DB=EPODOC&CC=CN&NR=115091057A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220923&DB=EPODOC&CC=CN&NR=115091057A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN MINGQIN</creatorcontrib><creatorcontrib>LEI XINGHUA</creatorcontrib><creatorcontrib>XIA YUHAI</creatorcontrib><creatorcontrib>CAI YACHAO</creatorcontrib><title>Flexible circuit board laser cutting equipment</title><description>The invention discloses flexible circuit board laser cutting equipment which comprises a base frame, an air cylinder, a laser cutter, a dust removal device, a sealing device, a pressing device, a clamping groove, a circuit board and a pressing winding device. The air cylinder is arranged on the base frame, the laser cutter is arranged at the output end of the air cylinder, and the dust removal device is arranged at the output end of the air cylinder and located around the laser cutter; the sealing device is arranged on the dust removal device, the pressing device is arranged on the base frame, the clamping groove is formed in the bottom of the base frame, the circuit board is arranged in the clamping groove in a transmission mode and can be pressed by the pressing device, and the pressing winding device is arranged on the base frame. The invention belongs to the technical field of circuit board production, and particularly relates to flexible circuit board laser cutting equipment which can press and fix a cir</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzy0mtyEzKSVVIzixKLs0sUUjKTyxKUchJLE4tUkguLSnJzEtXSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoamBpaGBqbmjsbEqAEADwsqwg</recordid><startdate>20220923</startdate><enddate>20220923</enddate><creator>CHEN MINGQIN</creator><creator>LEI XINGHUA</creator><creator>XIA YUHAI</creator><creator>CAI YACHAO</creator><scope>EVB</scope></search><sort><creationdate>20220923</creationdate><title>Flexible circuit board laser cutting equipment</title><author>CHEN MINGQIN ; LEI XINGHUA ; XIA YUHAI ; CAI YACHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115091057A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN MINGQIN</creatorcontrib><creatorcontrib>LEI XINGHUA</creatorcontrib><creatorcontrib>XIA YUHAI</creatorcontrib><creatorcontrib>CAI YACHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN MINGQIN</au><au>LEI XINGHUA</au><au>XIA YUHAI</au><au>CAI YACHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flexible circuit board laser cutting equipment</title><date>2022-09-23</date><risdate>2022</risdate><abstract>The invention discloses flexible circuit board laser cutting equipment which comprises a base frame, an air cylinder, a laser cutter, a dust removal device, a sealing device, a pressing device, a clamping groove, a circuit board and a pressing winding device. 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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Flexible circuit board laser cutting equipment |
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