Laser processing method of printed circuit board and laser processing device of printed circuit board
Provided are a laser processing method of a printed circuit board and a laser processing apparatus of a printed circuit board, which effectively use a laser oscillator to optimize processing efficiency and optimize quality. The laser processing method of the printed circuit board uses a laser oscill...
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| creator | ARAI KUNIO HATA IZUMI KANAYA YASUHIKO TATEISHI HIDENORI KITA YASUHIKO |
| description | Provided are a laser processing method of a printed circuit board and a laser processing apparatus of a printed circuit board, which effectively use a laser oscillator to optimize processing efficiency and optimize quality. The laser processing method of the printed circuit board uses a laser oscillator to perform laser processing, and the laser oscillator oscillates laser light by applying an RF pulse. In the laser light output period after the application of the RF pulse is finished, the RF pulse is applied again to continue the laser oscillation, and the laser light is extracted from the continuously oscillating laser light for a desired time to perform the laser processing of the printed circuit board.
提供一种印刷电路板的激光加工方法及印刷电路板的激光加工装置，其有效使用激光振荡器以优化加工效率并优化质量。所述印刷电路板的激光加工方法，使用激光振荡器以进行激光加工，所述激光振荡器是通过施加RF脉冲振荡激光。于所述RF脉冲的施加结束后的激光输出期间，通过再次施加所述RF脉冲以继续激光振荡，并从连续振荡的激光中取出所期望的时间的激光以进行印刷电路板的激光加工。 |
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提供一种印刷电路板的激光加工方法及印刷电路板的激光加工装置，其有效使用激光振荡器以优化加工效率并优化质量。所述印刷电路板的激光加工方法，使用激光振荡器以进行激光加工，所述激光振荡器是通过施加RF脉冲振荡激光。于所述RF脉冲的施加结束后的激光输出期间，通过再次施加所述RF脉冲以继续激光振荡，并从连续振荡的激光中取出所期望的时间的激光以进行印刷电路板的激光加工。</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220920&DB=EPODOC&CC=CN&NR=115070230A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220920&DB=EPODOC&CC=CN&NR=115070230A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARAI KUNIO</creatorcontrib><creatorcontrib>HATA IZUMI</creatorcontrib><creatorcontrib>KANAYA YASUHIKO</creatorcontrib><creatorcontrib>TATEISHI HIDENORI</creatorcontrib><creatorcontrib>KITA YASUHIKO</creatorcontrib><title>Laser processing method of printed circuit board and laser processing device of printed circuit board</title><description>Provided are a laser processing method of a printed circuit board and a laser processing apparatus of a printed circuit board, which effectively use a laser oscillator to optimize processing efficiency and optimize quality. The laser processing method of the printed circuit board uses a laser oscillator to perform laser processing, and the laser oscillator oscillates laser light by applying an RF pulse. In the laser light output period after the application of the RF pulse is finished, the RF pulse is applied again to continue the laser oscillation, and the laser light is extracted from the continuously oscillating laser light for a desired time to perform the laser processing of the printed circuit board.
提供一种印刷电路板的激光加工方法及印刷电路板的激光加工装置，其有效使用激光振荡器以优化加工效率并优化质量。所述印刷电路板的激光加工方法，使用激光振荡器以进行激光加工，所述激光振荡器是通过施加RF脉冲振荡激光。于所述RF脉冲的施加结束后的激光输出期间，通过再次施加所述RF脉冲以继续激光振荡，并从连续振荡的激光中取出所期望的时间的激光以进行印刷电路板的激光加工。</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj1SSxOLVIoKMpPTi0uzsxLV8hNLcnIT1HITwMKZuaVpKYoJGcWJZdmligk5ScWpSgk5qUo5KBrSkkty0xOxamJh4E1LTGnOJUXSnMzKLq5hjh76KYW5MenFhckJqfmpZbEO_sZGpoamBsYGRs4GhOjBgAzSz8q</recordid><startdate>20220920</startdate><enddate>20220920</enddate><creator>ARAI KUNIO</creator><creator>HATA IZUMI</creator><creator>KANAYA YASUHIKO</creator><creator>TATEISHI HIDENORI</creator><creator>KITA YASUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20220920</creationdate><title>Laser processing method of printed circuit board and laser processing device of printed circuit board</title><author>ARAI KUNIO ; HATA IZUMI ; KANAYA YASUHIKO ; TATEISHI HIDENORI ; KITA YASUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115070230A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ARAI KUNIO</creatorcontrib><creatorcontrib>HATA IZUMI</creatorcontrib><creatorcontrib>KANAYA YASUHIKO</creatorcontrib><creatorcontrib>TATEISHI HIDENORI</creatorcontrib><creatorcontrib>KITA YASUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARAI KUNIO</au><au>HATA IZUMI</au><au>KANAYA YASUHIKO</au><au>TATEISHI HIDENORI</au><au>KITA YASUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser processing method of printed circuit board and laser processing device of printed circuit board</title><date>2022-09-20</date><risdate>2022</risdate><abstract>Provided are a laser processing method of a printed circuit board and a laser processing apparatus of a printed circuit board, which effectively use a laser oscillator to optimize processing efficiency and optimize quality. The laser processing method of the printed circuit board uses a laser oscillator to perform laser processing, and the laser oscillator oscillates laser light by applying an RF pulse. In the laser light output period after the application of the RF pulse is finished, the RF pulse is applied again to continue the laser oscillation, and the laser light is extracted from the continuously oscillating laser light for a desired time to perform the laser processing of the printed circuit board.
提供一种印刷电路板的激光加工方法及印刷电路板的激光加工装置，其有效使用激光振荡器以优化加工效率并优化质量。所述印刷电路板的激光加工方法，使用激光振荡器以进行激光加工，所述激光振荡器是通过施加RF脉冲振荡激光。于所述RF脉冲的施加结束后的激光输出期间，通过再次施加所述RF脉冲以继续激光振荡，并从连续振荡的激光中取出所期望的时间的激光以进行印刷电路板的激光加工。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Laser processing method of printed circuit board and laser processing device of printed circuit board |
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