Grinding device for semiconductor wafer production
The grinding device for semiconductor wafer production comprises first linear sliding rails, first sliding blocks, a box body and a square pipe, the bottom end of the box body is fixedly connected with a bottom box, meanwhile, a box door is arranged on one side of the box body, and second linear sli...
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| creator | YIN ZEAN CHEN DIANWEN |
| description | The grinding device for semiconductor wafer production comprises first linear sliding rails, first sliding blocks, a box body and a square pipe, the bottom end of the box body is fixedly connected with a bottom box, meanwhile, a box door is arranged on one side of the box body, and second linear sliding rails are symmetrically arranged at the bottom end of the interior of the box body; a second sliding block is slidably connected to the second linear sliding rail, the top end of the second sliding block is fixedly connected to a bearing plate, a square hole is formed in the center of the bearing plate, a square pipe is placed in the square hole, the top end of the square pipe is fixedly connected to a placing plate, and placing grooves are formed in the two sides of the top end of the placing plate correspondingly; and meanwhile, connecting legs are fixedly connected to the four corners of the bottom end of the bearing plate correspondingly, the connecting pipes installed on the grinding wheel are limited thr |
| format | Patent |
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a second sliding block is slidably connected to the second linear sliding rail, the top end of the second sliding block is fixedly connected to a bearing plate, a square hole is formed in the center of the bearing plate, a square pipe is placed in the square hole, the top end of the square pipe is fixedly connected to a placing plate, and placing grooves are formed in the two sides of the top end of the placing plate correspondingly; and meanwhile, connecting legs are fixedly connected to the four corners of the bottom end of the bearing plate correspondingly, the connecting pipes installed on the grinding wheel are limited thr</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; 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a second sliding block is slidably connected to the second linear sliding rail, the top end of the second sliding block is fixedly connected to a bearing plate, a square hole is formed in the center of the bearing plate, a square pipe is placed in the square hole, the top end of the square pipe is fixedly connected to a placing plate, and placing grooves are formed in the two sides of the top end of the placing plate correspondingly; and meanwhile, connecting legs are fixedly connected to the four corners of the bottom end of the bearing plate correspondingly, the connecting pipes installed on the grinding wheel are limited thr</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDByL8rMS8nMS1dISS3LTE5VSMsvUihOzc1Mzs9LKU0uAfLKE9NSixQKivJB_Mz8PB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu_sZ2hoamBqZmBm4GhMjBoA8qEsbQ</recordid><startdate>20220916</startdate><enddate>20220916</enddate><creator>YIN ZEAN</creator><creator>CHEN DIANWEN</creator><scope>EVB</scope></search><sort><creationdate>20220916</creationdate><title>Grinding device for semiconductor wafer production</title><author>YIN ZEAN ; CHEN DIANWEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115056060A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YIN ZEAN</creatorcontrib><creatorcontrib>CHEN DIANWEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YIN ZEAN</au><au>CHEN DIANWEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding device for semiconductor wafer production</title><date>2022-09-16</date><risdate>2022</risdate><abstract>The grinding device for semiconductor wafer production comprises first linear sliding rails, first sliding blocks, a box body and a square pipe, the bottom end of the box body is fixedly connected with a bottom box, meanwhile, a box door is arranged on one side of the box body, and second linear sliding rails are symmetrically arranged at the bottom end of the interior of the box body; a second sliding block is slidably connected to the second linear sliding rail, the top end of the second sliding block is fixedly connected to a bearing plate, a square hole is formed in the center of the bearing plate, a square pipe is placed in the square hole, the top end of the square pipe is fixedly connected to a placing plate, and placing grooves are formed in the two sides of the top end of the placing plate correspondingly; and meanwhile, connecting legs are fixedly connected to the four corners of the bottom end of the bearing plate correspondingly, the connecting pipes installed on the grinding wheel are limited thr</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Grinding device for semiconductor wafer production |
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