MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY
The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded articl...
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| creator | SONG HANXIU KANG CHUL-YI LEE JAE-HYUK BAE SUNG-SOO JIANG YUANJUN |
| description | The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded article of the present invention can be economically manufactured by reducing production costs while improving mechanical properties compared to conventional products, and thus can be applied to sheets, pads, films, packaging papers, tubes, bags, interior materials, containers, trays for manufacturing electronic devices, and the like.
本发明涉及一种多层成型品，其包括表层和内层，从而具有至少两个层，尤其是，表层通过向粘合性树脂添加碳填充材料而提供优秀的粘合性和导电性。本发明的多层成型品与现有的产品相比，能够改善机械物性，并通过降低生产成本而经济地制造，由此能够应用于片材、衬垫、膜、包装纸、管材、袋、内饰材料、容器以及电子器件制造用托盘等。 |
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本发明涉及一种多层成型品，其包括表层和内层，从而具有至少两个层，尤其是，表层通过向粘合性树脂添加碳填充材料而提供优秀的粘合性和导电性。本发明的多层成型品与现有的产品相比，能够改善机械物性，并通过降低生产成本而经济地制造，由此能够应用于片材、衬垫、膜、包装纸、管材、袋、内饰材料、容器以及电子器件制造用托盘等。</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=CN&NR=115052744A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25553,76306</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=CN&NR=115052744A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG HANXIU</creatorcontrib><creatorcontrib>KANG CHUL-YI</creatorcontrib><creatorcontrib>LEE JAE-HYUK</creatorcontrib><creatorcontrib>BAE SUNG-SOO</creatorcontrib><creatorcontrib>JIANG YUANJUN</creatorcontrib><title>MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY</title><description>The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded article of the present invention can be economically manufactured by reducing production costs while improving mechanical properties compared to conventional products, and thus can be applied to sheets, pads, films, packaging papers, tubes, bags, interior materials, containers, trays for manufacturing electronic devices, and the like.
本发明涉及一种多层成型品，其包括表层和内层，从而具有至少两个层，尤其是，表层通过向粘合性树脂添加碳填充材料而提供优秀的粘合性和导电性。本发明的多层成型品与现有的产品相比，能够改善机械物性，并通过降低生产成本而经济地制造，由此能够应用于片材、衬垫、膜、包装纸、管材、袋、内饰材料、容器以及电子器件制造用托盘等。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxDfUJ8fRxjHQNUvD193FxdVFwDArxdPZxVfBwDPP0c1dwjXB29fFx9QtRcHTxcA32DHNVcPRzUXD293MJdQ7xDPMMieRhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGpgamRuYmJo7GxKgBAGuPK-g</recordid><startdate>20220913</startdate><enddate>20220913</enddate><creator>SONG HANXIU</creator><creator>KANG CHUL-YI</creator><creator>LEE JAE-HYUK</creator><creator>BAE SUNG-SOO</creator><creator>JIANG YUANJUN</creator><scope>EVB</scope></search><sort><creationdate>20220913</creationdate><title>MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY</title><author>SONG HANXIU ; KANG CHUL-YI ; LEE JAE-HYUK ; BAE SUNG-SOO ; JIANG YUANJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115052744A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG HANXIU</creatorcontrib><creatorcontrib>KANG CHUL-YI</creatorcontrib><creatorcontrib>LEE JAE-HYUK</creatorcontrib><creatorcontrib>BAE SUNG-SOO</creatorcontrib><creatorcontrib>JIANG YUANJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG HANXIU</au><au>KANG CHUL-YI</au><au>LEE JAE-HYUK</au><au>BAE SUNG-SOO</au><au>JIANG YUANJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY</title><date>2022-09-13</date><risdate>2022</risdate><abstract>The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded article of the present invention can be economically manufactured by reducing production costs while improving mechanical properties compared to conventional products, and thus can be applied to sheets, pads, films, packaging papers, tubes, bags, interior materials, containers, trays for manufacturing electronic devices, and the like.
本发明涉及一种多层成型品，其包括表层和内层，从而具有至少两个层，尤其是，表层通过向粘合性树脂添加碳填充材料而提供优秀的粘合性和导电性。本发明的多层成型品与现有的产品相比，能够改善机械物性，并通过降低生产成本而经济地制造，由此能够应用于片材、衬垫、膜、包装纸、管材、袋、内饰材料、容器以及电子器件制造用托盘等。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY |
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