MULTILAYER MOLDED ARTICLE HAVING EXCELLENT ADHESIVE AND CONDUCTIVITY

The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded articl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SONG HANXIU, KANG CHUL-YI, LEE JAE-HYUK, BAE SUNG-SOO, JIANG YUANJUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention relates to a multilayer molded article comprising a surface layer and an inner layer so as to have at least two layers, in particular, the surface layer provides excellent adhesiveness and conductivity by adding a carbon filler to an adhesive resin. The multilayer molded article of the present invention can be economically manufactured by reducing production costs while improving mechanical properties compared to conventional products, and thus can be applied to sheets, pads, films, packaging papers, tubes, bags, interior materials, containers, trays for manufacturing electronic devices, and the like. 本发明涉及一种多层成型品,其包括表层和内层,从而具有至少两个层,尤其是,表层通过向粘合性树脂添加碳填充材料而提供优秀的粘合性和导电性。本发明的多层成型品与现有的产品相比,能够改善机械物性,并通过降低生产成本而经济地制造,由此能够应用于片材、衬垫、膜、包装纸、管材、袋、内饰材料、容器以及电子器件制造用托盘等。