Manufacturing method of large-size metalized slot of PCB (Printed Circuit Board)

The invention discloses a method for manufacturing a large-size metalized slot of a PCB (Printed Circuit Board), which comprises the following steps of: when an inner-layer circuit is manufactured on an inner-layer core board, manufacturing a copper ring surrounding the metalized slot at a position...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE GUOYU, LI JIAHUI, LIU BAILAN, XUN RUIPING, HE JUNLONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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