Manufacturing method of large-size metalized slot of PCB (Printed Circuit Board)

The invention discloses a method for manufacturing a large-size metalized slot of a PCB (Printed Circuit Board), which comprises the following steps of: when an inner-layer circuit is manufactured on an inner-layer core board, manufacturing a copper ring surrounding the metalized slot at a position corresponding to the metalized slot; laminating the inner-layer core plate and the outer-layer copper foil through PP according to the lamination requirement, and then pressing to form a production plate; a slotted hole is milled in the production board, so that the copper ring on the inner layer is exposed on the wall surface of the slotted hole; baking the production board to remove stress on the production board; and plating a copper layer on the wall surface of the slotted hole through copper deposition and full-board electroplating to form a metalized slotted hole, and connecting the copper layer on the hole wall with the copper ring on the inner layer. According to the method, the binding force of the electro