Polishing device and polishing method
The invention relates to a grinding device and a grinding method. A grinding device is used for grinding a workpiece, the workpiece is provided with an edge, and the grinding device comprises a conveying mechanism, a grinding mechanism and a grinding mechanism, the polishing mechanism comprises at l...
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| creator | GE CHUNSHENG WANG XIAOLI LIU QIANG WANG AIGUO SUN LI GAO HONGLEI ZHOU WENJING FANG JINLIANG |
| description | The invention relates to a grinding device and a grinding method. A grinding device is used for grinding a workpiece, the workpiece is provided with an edge, and the grinding device comprises a conveying mechanism, a grinding mechanism and a grinding mechanism, the polishing mechanism comprises at least one polishing roller; wherein each polishing roller is located below a workpiece conveyed by the conveying mechanism and makes contact with the edge of the workpiece; each polishing roller is configured to revolve around a preset axis; wherein in the first direction, the central axis of the grinding roller is perpendicular to the preset axis in pairs. As the workpiece is conveyed in the first direction, the edge of the workpiece can be ground and rolled by the grinding roller which revolves around the preset axis, fillets can be well formed at the edge of the workpiece, stress concentration is prevented from being formed at the edge, and the service life of the workpiece can be effectively prolonged.
本申请涉及一种打磨 |
| format | Patent |
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本申请涉及一种打磨</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220906&DB=EPODOC&CC=CN&NR=115008290A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220906&DB=EPODOC&CC=CN&NR=115008290A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GE CHUNSHENG</creatorcontrib><creatorcontrib>WANG XIAOLI</creatorcontrib><creatorcontrib>LIU QIANG</creatorcontrib><creatorcontrib>WANG AIGUO</creatorcontrib><creatorcontrib>SUN LI</creatorcontrib><creatorcontrib>GAO HONGLEI</creatorcontrib><creatorcontrib>ZHOU WENJING</creatorcontrib><creatorcontrib>FANG JINLIANG</creatorcontrib><title>Polishing device and polishing method</title><description>The invention relates to a grinding device and a grinding method. A grinding device is used for grinding a workpiece, the workpiece is provided with an edge, and the grinding device comprises a conveying mechanism, a grinding mechanism and a grinding mechanism, the polishing mechanism comprises at least one polishing roller; wherein each polishing roller is located below a workpiece conveyed by the conveying mechanism and makes contact with the edge of the workpiece; each polishing roller is configured to revolve around a preset axis; wherein in the first direction, the central axis of the grinding roller is perpendicular to the preset axis in pairs. As the workpiece is conveyed in the first direction, the edge of the workpiece can be ground and rolled by the grinding roller which revolves around the preset axis, fillets can be well formed at the edge of the workpiece, stress concentration is prevented from being formed at the edge, and the service life of the workpiece can be effectively prolonged.
本申请涉及一种打磨</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFANyM_JLM7IzEtXSEkty0xOVUjMS1EogAvmppZk5KfwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ1MDAwsjSwNHY2LUAAA-9Sce</recordid><startdate>20220906</startdate><enddate>20220906</enddate><creator>GE CHUNSHENG</creator><creator>WANG XIAOLI</creator><creator>LIU QIANG</creator><creator>WANG AIGUO</creator><creator>SUN LI</creator><creator>GAO HONGLEI</creator><creator>ZHOU WENJING</creator><creator>FANG JINLIANG</creator><scope>EVB</scope></search><sort><creationdate>20220906</creationdate><title>Polishing device and polishing method</title><author>GE CHUNSHENG ; WANG XIAOLI ; LIU QIANG ; WANG AIGUO ; SUN LI ; GAO HONGLEI ; ZHOU WENJING ; FANG JINLIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115008290A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GE CHUNSHENG</creatorcontrib><creatorcontrib>WANG XIAOLI</creatorcontrib><creatorcontrib>LIU QIANG</creatorcontrib><creatorcontrib>WANG AIGUO</creatorcontrib><creatorcontrib>SUN LI</creatorcontrib><creatorcontrib>GAO HONGLEI</creatorcontrib><creatorcontrib>ZHOU WENJING</creatorcontrib><creatorcontrib>FANG JINLIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GE CHUNSHENG</au><au>WANG XIAOLI</au><au>LIU QIANG</au><au>WANG AIGUO</au><au>SUN LI</au><au>GAO HONGLEI</au><au>ZHOU WENJING</au><au>FANG JINLIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing device and polishing method</title><date>2022-09-06</date><risdate>2022</risdate><abstract>The invention relates to a grinding device and a grinding method. A grinding device is used for grinding a workpiece, the workpiece is provided with an edge, and the grinding device comprises a conveying mechanism, a grinding mechanism and a grinding mechanism, the polishing mechanism comprises at least one polishing roller; wherein each polishing roller is located below a workpiece conveyed by the conveying mechanism and makes contact with the edge of the workpiece; each polishing roller is configured to revolve around a preset axis; wherein in the first direction, the central axis of the grinding roller is perpendicular to the preset axis in pairs. As the workpiece is conveyed in the first direction, the edge of the workpiece can be ground and rolled by the grinding roller which revolves around the preset axis, fillets can be well formed at the edge of the workpiece, stress concentration is prevented from being formed at the edge, and the service life of the workpiece can be effectively prolonged.
本申请涉及一种打磨</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Polishing device and polishing method |
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