High-temperature lead-free soft solder and preparation method thereof

The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1%...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HU YUNDIAN, YING MINGMING, YANG SHUNWANG, WANG YUNXIANG, XIONG JIYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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