High-temperature lead-free soft solder and preparation method thereof
The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1%...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HU YUNDIAN YING MINGMING YANG SHUNWANG WANG YUNXIANG XIONG JIYUAN |
| description | The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1% of Ni, 0.03%-0.9% of Zr, 0.12%-0.36% of Zn, 3%-5% of Si, 0.02%-0.06% of Ce and the balance Sn and a small amount of inevitable impurities; the high-temperature lead-free soft solder prepared through the method has excellent welding performance, the melting temperature ranges from 420 DEG C to 440 DEG C, melting of the solder in secondary reflow soldering can be effectively avoided, and meanwhile the situation that a welded circuit board is damaged due to the fact that the welding temperature is too high, and then the reliability of the welding performance is affected can be avoided.
本发明涉及钎料技术领域，且公开了一种高温无铅软钎料及其制备方法，按重量百分比计由以下成分制成：1.2-3.6％Cu、0.8-1.5％Sb、0.01-0.1％Ni、0.03-0.9％Zr、0.12-0.36％Zn、3-5％Si、0.02-0.06％Ce、余量为Sn及少 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115008062A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115008062A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115008062A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAURuEsDqK-w_UBAqmidJVS6eTkXi7mjy2kSbi5vr8dfACXc5Zva_phfk9WsRQI60dAEextEIBqDromeghx8lQEhVc150QLdMqedIIgh73ZBI4Vh9935njvn91gUfKIWviFBB27R9NcnGvd9XQ7_2O-_sAzRQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-temperature lead-free soft solder and preparation method thereof</title><source>esp@cenet</source><creator>HU YUNDIAN ; YING MINGMING ; YANG SHUNWANG ; WANG YUNXIANG ; XIONG JIYUAN</creator><creatorcontrib>HU YUNDIAN ; YING MINGMING ; YANG SHUNWANG ; WANG YUNXIANG ; XIONG JIYUAN</creatorcontrib><description>The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1% of Ni, 0.03%-0.9% of Zr, 0.12%-0.36% of Zn, 3%-5% of Si, 0.02%-0.06% of Ce and the balance Sn and a small amount of inevitable impurities; the high-temperature lead-free soft solder prepared through the method has excellent welding performance, the melting temperature ranges from 420 DEG C to 440 DEG C, melting of the solder in secondary reflow soldering can be effectively avoided, and meanwhile the situation that a welded circuit board is damaged due to the fact that the welding temperature is too high, and then the reliability of the welding performance is affected can be avoided.
本发明涉及钎料技术领域，且公开了一种高温无铅软钎料及其制备方法，按重量百分比计由以下成分制成：1.2-3.6％Cu、0.8-1.5％Sb、0.01-0.1％Ni、0.03-0.9％Zr、0.12-0.36％Zn、3-5％Si、0.02-0.06％Ce、余量为Sn及少</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220906&DB=EPODOC&CC=CN&NR=115008062A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220906&DB=EPODOC&CC=CN&NR=115008062A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU YUNDIAN</creatorcontrib><creatorcontrib>YING MINGMING</creatorcontrib><creatorcontrib>YANG SHUNWANG</creatorcontrib><creatorcontrib>WANG YUNXIANG</creatorcontrib><creatorcontrib>XIONG JIYUAN</creatorcontrib><title>High-temperature lead-free soft solder and preparation method thereof</title><description>The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1% of Ni, 0.03%-0.9% of Zr, 0.12%-0.36% of Zn, 3%-5% of Si, 0.02%-0.06% of Ce and the balance Sn and a small amount of inevitable impurities; the high-temperature lead-free soft solder prepared through the method has excellent welding performance, the melting temperature ranges from 420 DEG C to 440 DEG C, melting of the solder in secondary reflow soldering can be effectively avoided, and meanwhile the situation that a welded circuit board is damaged due to the fact that the welding temperature is too high, and then the reliability of the welding performance is affected can be avoided.
本发明涉及钎料技术领域，且公开了一种高温无铅软钎料及其制备方法，按重量百分比计由以下成分制成：1.2-3.6％Cu、0.8-1.5％Sb、0.01-0.1％Ni、0.03-0.9％Zr、0.12-0.36％Zn、3-5％Si、0.02-0.06％Ce、余量为Sn及少</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAURuEsDqK-w_UBAqmidJVS6eTkXi7mjy2kSbi5vr8dfACXc5Zva_phfk9WsRQI60dAEextEIBqDromeghx8lQEhVc150QLdMqedIIgh73ZBI4Vh9935njvn91gUfKIWviFBB27R9NcnGvd9XQ7_2O-_sAzRQ</recordid><startdate>20220906</startdate><enddate>20220906</enddate><creator>HU YUNDIAN</creator><creator>YING MINGMING</creator><creator>YANG SHUNWANG</creator><creator>WANG YUNXIANG</creator><creator>XIONG JIYUAN</creator><scope>EVB</scope></search><sort><creationdate>20220906</creationdate><title>High-temperature lead-free soft solder and preparation method thereof</title><author>HU YUNDIAN ; YING MINGMING ; YANG SHUNWANG ; WANG YUNXIANG ; XIONG JIYUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115008062A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HU YUNDIAN</creatorcontrib><creatorcontrib>YING MINGMING</creatorcontrib><creatorcontrib>YANG SHUNWANG</creatorcontrib><creatorcontrib>WANG YUNXIANG</creatorcontrib><creatorcontrib>XIONG JIYUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU YUNDIAN</au><au>YING MINGMING</au><au>YANG SHUNWANG</au><au>WANG YUNXIANG</au><au>XIONG JIYUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-temperature lead-free soft solder and preparation method thereof</title><date>2022-09-06</date><risdate>2022</risdate><abstract>The invention relates to the technical field of brazing filler metal, and discloses high-temperature lead-free soft brazing filler metal and a preparation method thereof.The high-temperature lead-free soft brazing filler metal is prepared from, by weight, 1.2%-3.6% of Cu, 0.8%-1.5% of Sb, 0.01%-0.1% of Ni, 0.03%-0.9% of Zr, 0.12%-0.36% of Zn, 3%-5% of Si, 0.02%-0.06% of Ce and the balance Sn and a small amount of inevitable impurities; the high-temperature lead-free soft solder prepared through the method has excellent welding performance, the melting temperature ranges from 420 DEG C to 440 DEG C, melting of the solder in secondary reflow soldering can be effectively avoided, and meanwhile the situation that a welded circuit board is damaged due to the fact that the welding temperature is too high, and then the reliability of the welding performance is affected can be avoided.
本发明涉及钎料技术领域，且公开了一种高温无铅软钎料及其制备方法，按重量百分比计由以下成分制成：1.2-3.6％Cu、0.8-1.5％Sb、0.01-0.1％Ni、0.03-0.9％Zr、0.12-0.36％Zn、3-5％Si、0.02-0.06％Ce、余量为Sn及少</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN115008062A |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | High-temperature lead-free soft solder and preparation method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T19%3A51%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HU%20YUNDIAN&rft.date=2022-09-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115008062A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |