Mini-LED chip and preparation method thereof

According to the mini-LED chip and the preparation method provided by the invention, in the mini-LED chip, the ohmic contact resistance of the composite transparent conductive layer is reduced by the ohmic contact layer in the composite transparent conductive layer, the ohmic contact with the P-type...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CAI JIANJIU, LIU WEI, WU XINGEN, WANG RUI, CUI HENGPING, LIU YINGCE, LIN FENGJIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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