Photosensitive resin composition, dry film, solder resist, and printed wiring board

The invention provides a photosensitive resin composition which can improve developability and deep curability even if titanium oxide is contained, and can improve the appearance and reflectivity of a solder resist layer. The photosensitive resin composition contains a carboxyl group-containing resi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAI TAKASHI, MAEKAWA SAKINA, HIGUCHI MICHIYA, HASHIMOTO SOICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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