Preparation method of novel resin through hole adapter plate
The invention discloses a preparation method of a novel resin through hole adapter plate, which comprises the following steps of: firstly, manufacturing a metal layer and a copper column by adopting an electron beam selective melting 3D printing technology according to a 3D model of an interconnecti...
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| creator | HUANG MAIRUI ZHANG YOUXIN GENG JING LIU YANG |
| description | The invention discloses a preparation method of a novel resin through hole adapter plate, which comprises the following steps of: firstly, manufacturing a metal layer and a copper column by adopting an electron beam selective melting 3D printing technology according to a 3D model of an interconnection structure of the adapter plate; respectively fixing the copper column and the metal layer by using a plastic clamp according to the layout requirement of the adapter plate, and placing the copper column and the metal layer in a pouring mold; the preparation method comprises the following steps: preparing liquid matrix resin, transferring the liquid matrix resin into a mold after heating and vacuum defoaming, then putting the mold into a drying oven for curing, taking out the mold after curing is completed, and applying pressure to the mold by adopting a press machine at room temperature; finally, the prototype of the resin through hole adapter plate is demolded and taken out, and redundant resin outside the adap |
| format | Patent |
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respectively fixing the copper column and the metal layer by using a plastic clamp according to the layout requirement of the adapter plate, and placing the copper column and the metal layer in a pouring mold; the preparation method comprises the following steps: preparing liquid matrix resin, transferring the liquid matrix resin into a mold after heating and vacuum defoaming, then putting the mold into a drying oven for curing, taking out the mold after curing is completed, and applying pressure to the mold by adopting a press machine at room temperature; finally, the prototype of the resin through hole adapter plate is demolded and taken out, and redundant resin outside the adap</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; CASTING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; 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respectively fixing the copper column and the metal layer by using a plastic clamp according to the layout requirement of the adapter plate, and placing the copper column and the metal layer in a pouring mold; the preparation method comprises the following steps: preparing liquid matrix resin, transferring the liquid matrix resin into a mold after heating and vacuum defoaming, then putting the mold into a drying oven for curing, taking out the mold after curing is completed, and applying pressure to the mold by adopting a press machine at room temperature; finally, the prototype of the resin through hole adapter plate is demolded and taken out, and redundant resin outside the adap</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Preparation method of novel resin through hole adapter plate |
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