Preparation method of novel resin through hole adapter plate

The invention discloses a preparation method of a novel resin through hole adapter plate, which comprises the following steps of: firstly, manufacturing a metal layer and a copper column by adopting an electron beam selective melting 3D printing technology according to a 3D model of an interconnection structure of the adapter plate; respectively fixing the copper column and the metal layer by using a plastic clamp according to the layout requirement of the adapter plate, and placing the copper column and the metal layer in a pouring mold; the preparation method comprises the following steps: preparing liquid matrix resin, transferring the liquid matrix resin into a mold after heating and vacuum defoaming, then putting the mold into a drying oven for curing, taking out the mold after curing is completed, and applying pressure to the mold by adopting a press machine at room temperature; finally, the prototype of the resin through hole adapter plate is demolded and taken out, and redundant resin outside the adap