High-density fan-out packaging structure and preparation method thereof

The invention provides a high-density fan-out packaging structure and a preparation method thereof, and the method comprises the steps: providing a silicon substrate, and pasting a passive surface of a to-be-packaged chip on the silicon substrate; the chip to be packaged is subjected to plastic pack...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DING XIAOCHUN, LI ZONGYI, GUO LIANGKUI, LIANG XINFU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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