Multifunctional test equipment for semiconductor packaging device
A semiconductor packaging device multifunctional test device disclosed by the present invention comprises a test box, and further comprises a heat resistance detection assembly, a cold resistance detection assembly, a uniform material distribution assembly and a conveying detection assembly, the out...
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| creator | LIAO JUNNAN GU DEZONG FAN GUANGYU |
| description | A semiconductor packaging device multifunctional test device disclosed by the present invention comprises a test box, and further comprises a heat resistance detection assembly, a cold resistance detection assembly, a uniform material distribution assembly and a conveying detection assembly, the outer wall of one side of the test box is provided with symmetrically arranged transverse strips, and the uniform material distribution assembly is installed between the side walls of the transverse strips. An arc-shaped guide plate installed on the side wall of the test frame is arranged at the bottom of the uniform material distribution assembly, a heat resistance detection assembly and a cold resistance detection assembly which are arranged side by side are installed on the inner wall of the test box, the heat resistance detection assembly is arranged on the side close to the uniform material distribution assembly, and a conveying detection assembly is installed on the inner wall of the test box; the conveying dete |
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An arc-shaped guide plate installed on the side wall of the test frame is arranged at the bottom of the uniform material distribution assembly, a heat resistance detection assembly and a cold resistance detection assembly which are arranged side by side are installed on the inner wall of the test box, the heat resistance detection assembly is arranged on the side close to the uniform material distribution assembly, and a conveying detection assembly is installed on the inner wall of the test box; the conveying dete</description><language>chi ; eng</language><subject>PERFORMING OPERATIONS ; POSTAL SORTING ; SEPARATING SOLIDS FROM SOLIDS ; SORTING ; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220805&DB=EPODOC&CC=CN&NR=114850056A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220805&DB=EPODOC&CC=CN&NR=114850056A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIAO JUNNAN</creatorcontrib><creatorcontrib>GU DEZONG</creatorcontrib><creatorcontrib>FAN GUANGYU</creatorcontrib><title>Multifunctional test equipment for semiconductor packaging device</title><description>A semiconductor packaging device multifunctional test device disclosed by the present invention comprises a test box, and further comprises a heat resistance detection assembly, a cold resistance detection assembly, a uniform material distribution assembly and a conveying detection assembly, the outer wall of one side of the test box is provided with symmetrically arranged transverse strips, and the uniform material distribution assembly is installed between the side walls of the transverse strips. An arc-shaped guide plate installed on the side wall of the test frame is arranged at the bottom of the uniform material distribution assembly, a heat resistance detection assembly and a cold resistance detection assembly which are arranged side by side are installed on the inner wall of the test box, the heat resistance detection assembly is arranged on the side close to the uniform material distribution assembly, and a conveying detection assembly is installed on the inner wall of the test box; the conveying dete</description><subject>PERFORMING OPERATIONS</subject><subject>POSTAL SORTING</subject><subject>SEPARATING SOLIDS FROM SOLIDS</subject><subject>SORTING</subject><subject>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0Lc0pyUwrzUsuyczPS8xRKEktLlFILSzNLMhNzStRSMsvUihOzc1Mzs9LKU0uAfIKEpOzE9Mz89IVUlLLMpNTeRhY0xJzilN5oTQ3g6Kba4izh25qQX58ajFQeWpeakm8s5-hoYmFqYGBqZmjMTFqAH7tMpU</recordid><startdate>20220805</startdate><enddate>20220805</enddate><creator>LIAO JUNNAN</creator><creator>GU DEZONG</creator><creator>FAN GUANGYU</creator><scope>EVB</scope></search><sort><creationdate>20220805</creationdate><title>Multifunctional test equipment for semiconductor packaging device</title><author>LIAO JUNNAN ; GU DEZONG ; FAN GUANGYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114850056A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>PERFORMING OPERATIONS</topic><topic>POSTAL SORTING</topic><topic>SEPARATING SOLIDS FROM SOLIDS</topic><topic>SORTING</topic><topic>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIAO JUNNAN</creatorcontrib><creatorcontrib>GU DEZONG</creatorcontrib><creatorcontrib>FAN GUANGYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIAO JUNNAN</au><au>GU DEZONG</au><au>FAN GUANGYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multifunctional test equipment for semiconductor packaging device</title><date>2022-08-05</date><risdate>2022</risdate><abstract>A semiconductor packaging device multifunctional test device disclosed by the present invention comprises a test box, and further comprises a heat resistance detection assembly, a cold resistance detection assembly, a uniform material distribution assembly and a conveying detection assembly, the outer wall of one side of the test box is provided with symmetrically arranged transverse strips, and the uniform material distribution assembly is installed between the side walls of the transverse strips. 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| language | chi ; eng |
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| subjects | PERFORMING OPERATIONS POSTAL SORTING SEPARATING SOLIDS FROM SOLIDS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TRANSPORTING |
| title | Multifunctional test equipment for semiconductor packaging device |
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