Semiconductor device, junction circuit, and method of manufacturing semiconductor device

A semiconductor device includes a first semiconductor die and a second semiconductor die, where the second semiconductor die includes a side surface bonded to the first semiconductor die such that the second semiconductor die is perpendicular to the first semiconductor die. The semiconductor device...

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Bibliographische Detailangaben
Hauptverfasser: LAI JIAPING, ZHANG RENYUAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A semiconductor device includes a first semiconductor die and a second semiconductor die, where the second semiconductor die includes a side surface bonded to the first semiconductor die such that the second semiconductor die is perpendicular to the first semiconductor die. The semiconductor device also includes a junction circuit for connecting the first semiconductor die to the second semiconductor die. 一种半导体装置、接面电路及制造半导体装置的方法,半导体装置包括第一半导体晶粒以及第二半导体晶粒,其中第二半导体晶粒包括接合至第一半导体晶粒的侧表面,使得第二半导体晶粒垂直于第一半导体晶粒。半导体装置还包括接面电路,用于将第一半导体晶粒连接至第二半导体晶粒。